SCHEMBL215313

SCHEMBL215313

CO[Si](CCC12CCCCC1O2)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1023347 0.87
SCHEMBL215610 0.84
SCHEMBL9775468 0.81
SCHEMBL30976980 0.80
SCHEMBL15941296 0.79
SCHEMBL1022564 0.78
SCHEMBL530067 0.76
SCHEMBL9488078 0.74
SCHEMBL27294763 0.73
SCHEMBL1485733 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 204 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0554101-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1993-08-04 EP claimed
US-5004869-A Having silica thickener, organosilane coupler, polyfunctional bridging agent; waterproof, chemically inert to plastics, adhesives AMP INCORPORATED (US) 1991-04-02 US claimed
US-12624168-B2 Methods for making polyfunctional organosiloxanes and compositions containing same DOW SILICONES CORPORATION (US) 2026-05-12 US disclosed
WO-2026085577-A1 INSECTICIDE COMPOSITION AND USE THEREOF CALLINGTON HAVEN PTY LTD (AU) 2026-04-30 WO disclosed
EP-3420045-B1 SELECTIVE ADHESION SILICONE RUBBER DOW SILICONES CORP (US) 2026-04-22 EP disclosed
US-20250321481-A1 PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-10-16 US disclosed
US-12441844-B2 Methods for making polyfunctional organosiloxanes and compositions containing same DOW GLOBAL TECHNOLOGIES LLC (US) 2025-10-14 US disclosed
US-20250199401-A1 RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2025-06-19 US disclosed
US-20250189891-A1 POLYIMIDE RESIN PRECURSOR TOKYO OHKA KOGYO CO., LTD. (JP) 2025-06-12 US disclosed
EP-3898775-B1 POLYFUNCTIONAL ORGANOSILOXANES, COMPOSITIONS CONTAINING SAME, AND METHODS FOR THE PREPARATION THEREOF DOW SILICONES CORP (US) 2025-03-12 EP disclosed
US-20250004372-A1 BLOCK COPOLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2025-01-02 US disclosed
US-20020028335-A1 Silicone rubber adhesive composition and integrally molded article thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-03-07 US disclosed
US-20020009635-A1 Novel materials for use as electrolytic solutes MICHOT CHRISTOPHE (FR) 2002-01-24 US disclosed
EP-1172413-A2 Silicone rubber adhesive composition and integrally molded article thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-01-16 EP disclosed
EP-1172414-A2 Silicone rubber adhesive composition and integrally molded article thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-01-16 EP disclosed
US-6331588-B1 WITH REINFORCING SILICA FINES HAVING BEEN SURFACE TREATED SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-12-18 US disclosed
US-5700853-A CURABLE POLYSILOXANE BLENDS COMPRISING CURING AGENT AND SILICA POWDER FILLER; LOW VISCOSITY, FLUID FLOW, DIELECTRICS, NONABSORBENT, WEATHERPROOFING, HEAT RESISTANCE SHIN-ETSU CHEMICAL CO., LTD. (JP) 1997-12-23 US disclosed
US-5691407-A SILICA, ALUMINUM HYDROXIDE WITH ORGANOPOLYSILOXANES SHIN-ETSU CHEMICAL CO., LTD. (JP) 1997-11-25 US disclosed
EP-0554101-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1993-08-04 EP disclosed
US-5004869-A Having silica thickener, organosilane coupler, polyfunctional bridging agent; waterproof, chemically inert to plastics, adhesives AMP INCORPORATED (US) 1991-04-02 US disclosed