SCHEMBL2155072

SCHEMBL2155072

CC([O])(O)CO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL263431 0.78
SCHEMBL263435 0.75
SCHEMBL42569 0.73
SCHEMBL635712 0.73
SCHEMBL16430164 0.73
SCHEMBL12478173 0.73
SCHEMBL1301286 0.71
SCHEMBL330407 0.71
SCHEMBL21487907 0.70
SCHEMBL283797 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116057057-A Conjugates of alpha 2-adrenoceptor subtype C (alpha-2C) antagonists and TASK1/3 channel blockers for the treatment of sleep apnea 拜耳公司 2023-05-02 CN disclosed
US-20200180202-A1 PRODUCTION OF AN ADHESIVE COMPOSITION IN AN EXTRUDER BOSTIK SA (FR) 2020-06-11 US disclosed
EP-3648947-A1 PRODUCTION OF AN ADHESIVE COMPOSITION IN AN EXTRUDER Bostik SA (FR) 2020-05-13 EP disclosed
WO-2019008258-A1 PRODUCTION OF AN ADHESIVE COMPOSITION IN AN EXTRUDER BOSTIK SA (FR) 2019-01-10 WO disclosed
US-20180355283-A1 CLEANING COMPOSITION FOR INDUSTRIAL COATING LINE BOSTIK SA (FR) 2018-12-13 US disclosed
EP-3387105-A1 CLEANING COMPOSITION FOR INDUSTRIAL COATING LINE BOSTIK SA (FR) 2018-10-17 EP disclosed
WO-2017098136-A1 CLEANING COMPOSITION FOR INDUSTRIAL COATING LINE BOSTIK SA (FR) 2017-06-15 WO disclosed
US-9518201-B2 Adhesive composition that can be peeled after crosslinking BOSTIK S.A. (FR) 2016-12-13 US disclosed
EP-2199343-B1 Adhesive composition which can be peeled off after cross-linking BOSTIK SA (FR) 2013-04-10 EP disclosed
EP-2235133-B1 PRESSURE-SENSITIVE ADHESIVES HAVING A TEMPERATURE-STABLE ADHESIVE POWER BOSTIK SA (FR) 2011-07-13 EP disclosed
EP-2235133-A2 PRESSURE-SENSITIVE ADHESIVES HAVING A TEMPERATURE-STABLE ADHESIVE POWER BOSTIK SA (FR) 2010-10-06 EP disclosed
US-20100154991-A1 ADHESIVE COMPOSITION THAT CAN BE PEELED AFTER CROSSLINKING BOSTIK S.A. (FR) 2010-06-24 US disclosed
EP-2199343-A1 Adhesive composition which can be peeled off after cross-linking Bostik SA (FR) 2010-06-23 EP disclosed
WO-2009106699-A2 PRESSURE-SENSITIVE ADHESIVES HAVING A TEMPERATURE-STABLE ADHESIVE POWER BOSTIK SA (FR) 2009-09-03 WO disclosed
EP-1284267-B1 TRIAZOLE COMPOUNDS HAVING AMIDE LINKAGE SANKYO CO (JP) 2004-12-15 EP disclosed
US-6653330-B2 Such as 4'-chloro-4-(5-(3-(2,4-difluorophenyl)-3-hydroxy-2-methyl-4-(1H-1,2,4 -triazol-1-y)butyl)-1,3-dioxan-2-yl)-benzanilide; antifungal activity SANKYO COMPANY, LIMITED (JP) 2003-11-25 US disclosed
US-20030176480-A1 For therapy and prophylaxis of fungal infections SANKYO COMPANY, LIMITED (JP) 2003-09-18 US disclosed
EP-1284267-A1 TRIAZOLE COMPOUNDS HAVING AMIDE LINKAGE Sankyo Company, Limited (JP) 2003-02-19 EP disclosed