⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9881051 | 0.79 | ABCB1 (0.36) | — | |
| SCHEMBL5527141 | 0.79 | RECQL (0.32) | — | |
| SCHEMBL21910758 | 0.78 | ABCB1 (0.32) | — | |
| SCHEMBL15181041 | 0.75 | — | — | |
| SCHEMBL14417112 | 0.71 | — | — | |
| SCHEMBL10061185 | 0.70 | ABCB1 (0.32) | — | |
| SCHEMBL12869724 | 0.70 | CYP19A1 (0.33) | — | |
| SCHEMBL10016729 | 0.68 | PPARG (0.32) | — | |
| SCHEMBL12764998 | 0.67 | CYP19A1 (0.32) | — | |
| SCHEMBL12705184 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11803122-B2 | Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-10-31 | — | — | US | disclosed |
| US-11803122-B2 | Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-10-31 | — | — | US | disclosed |
| US-11754926-B2 | Method of forming resist pattern, resist composition and method of producing the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-09-12 | — | — | US | disclosed |
| US-20230273521-A1 | CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-08-31 | — | — | US | disclosed |
| WO-2023162552-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE COMPOSITION, PRODUCTION METHOD FOR SUBSTRATE WITH TEMPLATE, AND PRODUCTION METHOD FOR PLATED ARTICLE | 東京応化工業株式会社 | 2023-08-31 | — | — | WO | disclosed |
| US-20230229084-A1 | CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-07-20 | — | — | US | disclosed |
| WO-2023068251-A1 | RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, COMPOUND, AND ACID DIFFUSION CONTROL AGENT | 東京応化工業株式会社 | 2023-04-27 | — | — | WO | disclosed |
| US-20230127914-A1 | RESIST PATTERN FORMATION METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-04-27 | — | — | US | disclosed |
| US-20230127914-A1 | RESIST PATTERN FORMATION METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-04-27 | — | — | US | disclosed |
| US-11550221-B2 | Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template, method of manufacturing plated article, and nitrogen-containing aromatic heterocyclic compound | TOKYO OHKA KOG YO CO., LTD. (JP) | 2023-01-10 | — | — | US | disclosed |
| US-20220026801-A1 | CHEMICALLY AMPLIFIED POSITIVE -TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD (JP) | 2022-01-27 | — | — | US | disclosed |
| WO-2022004290-A1 | CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD FOR MANUFACTURING PLATING MOLD-ATTACHED SUBSTRATE, AND METHOD FOR MANUFACTURING PLATED OBJECT | 東京応化工業株式会社 | 2022-01-06 | — | — | WO | disclosed |
| US-20210356863-A1 | CHEMICAL AMPLIFICATION-TYPE PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF PATTERNED RESIST LAYER, PRODUCTION METHOD OF PLATED MOLDED ARTICLE, COMPOUND, AND PRODUCTION METHOD OF COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-11-18 | — | — | US | disclosed |
| US-11131927-B2 | Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template and method of manufacturing plated article | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-09-28 | — | — | US | disclosed |
| WO-2021131538-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING PATTERNED RESIST FILM, METHOD FOR PRODUCING SUBSTRATE PROVIDED WITH TEMPLATE, AND METHOD FOR PRODUCING PLATED MODELED OBJECT | 東京応化工業株式会社 | 2021-07-01 | — | — | WO | disclosed |
| WO-2021024925-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD FOR PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD FOR PATTERNED RESIST FILM, AND PRODUCTION METHOD FOR COMPOUND, PHOTO-ACID GENERATOR, AND N–ORGANOSULFONYLOXY COMPOUND | 東京応化工業株式会社 | 2021-02-11 | — | — | WO | disclosed |
| EP-3761117-A1 | METHOD FOR MANUFACTURING PLATED MOLDED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-01-06 | — | — | EP | disclosed |
| US-20200209748-A1 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-07-02 | — | — | US | disclosed |
| US-20190346765-A1 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE AND METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-11-14 | — | — | US | disclosed |