⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL24835120 | 0.90 | — | — | |
| SCHEMBL17130198 | 0.76 | — | — | |
| SCHEMBL1106850 | 0.72 | ANPEP (0.33) | — | |
| SCHEMBL20393244 | 0.65 | — | — | |
| SCHEMBL20868139 | 0.63 | — | — | |
| SCHEMBL21567701 | 0.62 | ANPEP (0.31) | — | |
| SCHEMBL24646006 | 0.61 | — | — | |
| SCHEMBL20625972 | 0.59 | — | — | |
| SCHEMBL22413628 | 0.57 | ANPEP (0.35) | — | |
| SCHEMBL19850883 | 0.57 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230127914-A1 | RESIST PATTERN FORMATION METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-04-27 | — | — | US | disclosed |
| US-11131927-B2 | Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template and method of manufacturing plated article | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-09-28 | — | — | US | disclosed |
| US-20200209739-A1 | CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD OF MANUFACTURING PLATED ARTICLE, AND COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-07-02 | — | — | US | disclosed |
| US-20190346765-A1 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE AND METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-11-14 | — | — | US | disclosed |