⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13123291 | 0.69 | ALDH1A1 (0.31) | — | |
| SCHEMBL24167902 | 0.66 | — | — | |
| SCHEMBL24705819 | 0.64 | — | — | |
| SCHEMBL19936680 | 0.63 | — | — | |
| SCHEMBL19001717 | 0.63 | — | — | |
| SCHEMBL24131275 | 0.61 | — | — | |
| SCHEMBL23340198 | 0.61 | — | — | |
| SCHEMBL20620011 | 0.59 | — | — | |
| SCHEMBL24505844 | 0.59 | — | — | |
| SCHEMBL24628793 | 0.58 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20190352548-A1 | RESIN COMPOSITON, REMOVABLE ADHESIVE LAYER, IC SUBSTRATE, AND IC PACKAGING PROCESS | Leading Interconnect Semiconductor Technology Qinhuangdao Co., Ltd. (CN) | 2019-11-21 | — | — | US | disclosed |