SCHEMBL2160906

SCHEMBL2160906

F[CH]I

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18984825 0.72
SCHEMBL1866728 0.72
SCHEMBL9752811 0.72
SCHEMBL471774 0.67
SCHEMBL5135 0.61
SCHEMBL38267 0.61
SCHEMBL2331212 0.58
SCHEMBL2009514 0.58
SCHEMBL17732216 0.58
SCHEMBL2264148 0.55

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109821181-B Fireproof and/or fire-extinguishing microcapsule, preparation method and application thereof 苏州海云涂层技术有限公司 2022-06-03 CN claimed
EP-1587604-B1 PROCESS FOR DECOMPOSING FLUORINE COMPOUNDS SHOWA DENKO KK (JP) 2006-11-29 EP claimed
US-20060140836-A1 Process for decomposing fluorine compounds SHOWA DENKO K.K. (JP) 2006-06-29 US claimed
EP-1608456-A1 HALOCARBON DESTRUCTION Ceimig Limited (GB) 2005-12-28 EP claimed
EP-1587604-A1 PROCESS FOR DECOMPOSING FLUORINE COMPOUNDS Showa Denko K.K. (JP) 2005-10-26 EP claimed
WO-2004067152-A1 PROCESS FOR DECOMPOSING FLUORINE COMPOUNDS SHOWA DENKO K. K. (JP) 2004-08-12 WO claimed
WO-2004052513-A1 HALOCARBON DESTRUCTION CEIMIG LIMITED (GB) 2004-06-24 WO claimed
US-5786401-A CONCURRENT BLOWING, MOLDING OF POLYURETHANE MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1998-07-28 US claimed
US-5741825-A CLOSED CELL FOAM FOR HEAT RESISTANCE FORMED BY BLOWING WITH IODOFLUOROHYDROCARBONS AND HYDROGEN CONTAINING FLUOROMORPHOLINE MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1998-04-21 US claimed
EP-0700953-A2 Thermal insulating foamed material and method for manufacturing the same MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1996-03-13 EP claimed
JP-8169976-A None JP disclosed
CN-116744926-A Compounds as inhibitors of casein kinase 北京原基华毅生物科技有限公司 2023-09-12 CN disclosed
US-20230203231-A1 USE OF EPOXY COMPOUNDS AS CARBON DIOXIDE SCAVENGERS IN PIR COMPRISING FOAMS FOR SUPERIOR THERMAL INSULATION PROPERTIES HUNTSMAN INTERNATIONAL LLC 2023-06-29 US disclosed
EP-4157910-A1 USE OF EPOXY COMPOUNDS AS CARBON DIOXIDE SCAVENGERS IN PIR COMPRISING FOAMS FOR SUPERIOR THERMAL INSULATION PROPERTIES Huntsman International LLC (US) 2023-04-05 EP disclosed
CN-109821181-B Fireproof and/or fire-extinguishing microcapsule, preparation method and application thereof 苏州海云涂层技术有限公司 2022-06-03 CN disclosed
JP-H08169976-A HEAT-INSULATING RESIN FOAM AND ITS PRODUCTION MATSUSHITA ELECTRIC IND CO LTD 1996-07-02 JP disclosed
EP-0700953-A2 Thermal insulating foamed material and method for manufacturing the same MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1996-03-13 EP disclosed
EP-0700953-A2 Thermal insulating foamed material and method for manufacturing the same MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1996-03-13 EP disclosed
US-5455319-A Also adding free radical generating initiator; low molecular weight polymer product, polydispersity THE GEON COMPANY (US) 1995-10-03 US disclosed
EP-0617057-A1 Pseudo-living radical polymerization The Geon Company (US) 1994-09-28 EP disclosed