⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18984825 | 1.00 | — | — | |
| SCHEMBL1866728 | 1.00 | — | — | |
| SCHEMBL2160906 | 0.72 | — | — | |
| SCHEMBL5178147 | 0.63 | — | — | |
| SCHEMBL2264148 | 0.63 | — | — | |
| SCHEMBL529 | 0.63 | — | — | |
| SCHEMBL56 | 0.63 | — | — | |
| SCHEMBL1760771 | 0.63 | — | — | |
| SCHEMBL21072680 | 0.63 | — | — | |
| SCHEMBL2331212 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3563406-B1 | IODINE-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | AIR LIQUIDE (FR) | 2024-04-24 | — | — | EP | disclosed |
| CN-111655659-B | Method for producing compound having butadiene skeleton containing hydrogen and fluorine and/or chlorine | 关东电化工业株式会社 | 2023-03-28 | — | — | CN | disclosed |
| US-11430663-B2 | Iodine-containing compounds for etching semiconductor structures | AMERICAN AIR LIQUIDE, INC. (US) | 2022-08-30 | — | — | US | disclosed |
| US-20200377434-A1 | METHOD OF PRODUCING COMPOUND HAVING BUTADIENE SKELETON CONTAINING HYDROGEN AND FLUORINE AND/OR CHLORINE | KANTO DENKA KOGYO CO., LTD. (JP) | 2020-12-03 | — | — | US | disclosed |
| CN-111655659-A | Method for producing compound having butadiene skeleton containing hydrogen and fluorine and/or chlorine | 关东电化工业株式会社 | 2020-09-11 | — | — | CN | disclosed |
| US-20200203174-A1 | IODINE-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | AIR LIQUIDE AMERICAN (US) | 2020-06-25 | — | — | US | disclosed |
| US-20200203174-A1 | IODINE-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | AIR LIQUIDE AMERICAN (US) | 2020-06-25 | — | — | US | disclosed |
| US-10607850-B2 | Iodine-containing compounds for etching semiconductor structures | AMERICAN AIR LIQUIDE, INC. (US) | 2020-03-31 | — | — | US | disclosed |
| US-10607850-B2 | Iodine-containing compounds for etching semiconductor structures | AMERICAN AIR LIQUIDE, INC. (US) | 2020-03-31 | — | — | US | disclosed |
| CN-110546125-A | method for producing compound having butadiene skeleton containing hydrogen and fluorine and/or chlorine | KANTO DENKA KOGYO KK | 2019-12-06 | — | — | CN | disclosed |
| WO-2019151467-A1 | METHOD FOR PRODUCING COMPOUND HAVING BUTADIENE SKELETON CONTAINING HYDROGEN AND FLUORINE AND/OR CHLORINE | 関東電化工業株式会社 | 2019-08-08 | — | — | WO | disclosed |
| US-20170178923-A1 | IODINE-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | AMERICAN AIR LIQUIDE, INC. | 2017-06-22 | — | — | US | disclosed |
| US-20170178923-A1 | IODINE-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | AMERICAN AIR LIQUIDE, INC. | 2017-06-22 | — | — | US | disclosed |
| US-20170178923-A1 | IODINE-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | AMERICAN AIR LIQUIDE, INC. | 2017-06-22 | — | — | US | disclosed |
| WO-1991009001-A1 | 1,1,2-TRIFLUORO-6-IODO-1-HEXENE, 1,1,2-TRIFLUORO-1,5-HEXADIENE, AND PROCESSES THEREFOR | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1991-06-27 | — | — | WO | disclosed |
| US-5015790-A | 1,1,2-trifluoro-6-iodo-1-hexene, 1,1,2-trifluoro-1,5-hexadiene, and processes therefore | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1991-05-14 | — | — | US | disclosed |