SCHEMBL2163492

SCHEMBL2163492

CCC(C)(C)c1cc(C)cc(C(C)(C)CC)c1OCC(CO)(CO)CO

nearest known ligand 0.32

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 4/20 0.32
ALDH1A1 P00352 2/20 0.32
CA2 P00918 1/20 0.32
POLB P06746 1/20 0.32
TYR P14679 1/20 0.32
CYP3A4 P08684 1/20 0.31
CYP2D6 P10635 1/20 0.31
HSPA5 P11021 1/20 0.31
MEN1 O00255 2/20 0.31
MAPK1 P28482 2/20 0.31
KMT2A Q03164 2/20 0.31
NPSR1 Q6W5P4 2/20 0.31
GLA P06280 1/20 0.31
MAPT P10636 1/20 0.31
HTT P42858 1/20 0.31
UBE2N P61088 1/20 0.31
CYP2C9 P11712 1/20 0.30
CYP2C19 P33261 1/20 0.30
HIF1A Q16665 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28958829 0.86 CYP3A4 (0.33) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL2232697 0.85 SMN1; SMN2 (0.44) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL27979672 0.83
SCHEMBL3106078 0.81 CYP2D6 (0.43) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL28610704 0.81 CYP2D6 (0.43) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL28706484 0.78 CYP2D6 (0.38) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL29000711 0.76
Pyrophosphoric Acid SCHEMBL5181896 0.75 HSPA5 (0.36) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL3106072 0.73 CYP2D6 (0.36) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL27523155 0.72 HSPA5 (0.44) SMN1; SMN2ALDH1A1CYP3A4HSPA5MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114672154-B Semi-aromatic polyamide molding composition for LED 金发科技股份有限公司 2024-04-02 CN disclosed
CN-114133560-B Process for the preparation of semiaromatic polyamides with improved impact strength, semiaromatic polyamides and moulding compositions 山东广垠新材料有限公司 2024-03-08 CN disclosed
CN-112601776-B Polyamide and polyamide composition 株式会社可乐丽 2024-01-02 CN disclosed
CN-114058009-B Process for the preparation of semi-aromatic polyamides with reduced diamine monomer loss, semi-aromatic polyamides and molding compositions 山东广垠新材料有限公司 2023-11-10 CN disclosed
CN-110964316-B Polyamide composition, molded article, and semi-aromatic polyamide 旭化成株式会社 2023-02-17 CN disclosed
CN-114773841-A Polyamide composition and molded article 旭化成株式会社 2022-07-22 CN disclosed
CN-114672154-A Semi-aromatic polyamide molding composition for LED 金发科技股份有限公司 2022-06-28 CN disclosed
CN-110506079-B Polyamide composition and molded article 旭化成株式会社 2022-03-22 CN disclosed
CN-112759923-A Glass fiber reinforced semi-aromatic polyamide molding composition with specific glass fiber length and molded product 金发科技股份有限公司 2021-05-07 CN disclosed
CN-112601776-A Polyamide and polyamide composition 株式会社可乐丽 2021-04-02 CN disclosed
CN-104937034-B Daiamid composition and formed products 旭化成株式会社 2016-08-24 CN disclosed
US-20110183243-A1 ELECTROPHOTOGRAPHIC PHOTORECEPTOR AND ELECTROPHOTOGRAPHIC IMAGING APPARATUS INCLUDING THE PHOTORECEPTOR SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-07-28 US disclosed