SCHEMBL27979672

SCHEMBL27979672

CCC(C)(C)c1cc(CN)cc(C(C)(C)CC)c1OCC(CO)(CO)CO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28062583 0.87 CYP3A4 (0.31)
SCHEMBL27284159 0.86 ALDH1A1 (0.37)
SCHEMBL2163492 0.83 SMN1; SMN2 (0.32)
SCHEMBL27494716 0.82 MEN1 (0.34)
Phosphoric Acid SCHEMBL27622426 0.80 MEN1 (0.33)
SCHEMBL28819939 0.80 MEN1 (0.33)
Pyrophosphoric Acid SCHEMBL27490053 0.77 MEN1 (0.31)
Pyrophosphoric Acid SCHEMBL27558863 0.76 MEN1 (0.30)
SCHEMBL27523155 0.75 HSPA5 (0.44)
SCHEMBL27853463 0.72 NPC1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104672444-B A kind of polyamide and consisting of daiamid composition 珠海万通特种工程塑料有限公司 2016-08-24 CN disclosed
CN-105849196-A Polyamide composition, molded article, reflective board for LEDs, and method for preventing heat-induced reflectivity reduction 旭化成株式会社 2016-08-10 CN disclosed
CN-105518180-A Thermoplastic resin composition, resin molded article, and method for producing plating-layer-equipped resin molded article MITSUBISHI ENGINEERING-PLASTICS CORP 2016-04-20 CN disclosed
CN-103443328-B The manufacture method of the synthetic resin of thermoplastic resin composition, synthetic resin and band coating MITSUBISHI CHEMICAL EUROP GMBH (DE) 2016-02-24 CN disclosed
CN-103403063-B Polymeric amide and daiamid composition ASAHI KASEI CHEMICALS CORP. (JP) 2016-01-20 CN disclosed
CN-104937034-A Polyamide composition and molded article ASAHI KASEI CHEMICALS CORP 2015-09-23 CN disclosed
CN-103597037-B The manufacture method of the synthetic resin of thermoplastic resin composition, synthetic resin and band coating MITSUBISHI ENGINEERING-PLASTICS CORP. (JP) 2015-08-19 CN disclosed
CN-104804186-A Polyamide resin and polyamide composition comprising same KINGFA SCIENCE & TECHNOLOGY CO 2015-07-29 CN disclosed
CN-104804429-A Polyamide resin and polyamide composition comprising same KINGFA SCIENCE & TECHNOLOGY CO 2015-07-29 CN disclosed
CN-104672444-A Polyamide resin and polyamide composition formed by same KINGFA SCIENCE & TECHNOLOGY CO 2015-06-03 CN disclosed
CN-101970535-B Polyamide, polyamide composition, and method for producing polyamide ASAHI KASEI CHEMICALS CORP 2015-05-27 CN disclosed
CN-104428346-A Polyamide, polyamide composition, and molded article ASAHI KASEI CHEMICALS CORP 2015-03-18 CN disclosed
CN-103314034-B Copolymer polyamide ASAHI KASEI CHEMICALS CORP 2015-01-07 CN disclosed
CN-103597037-A Thermoplastic resin composition, resin molding product, and method for producing resin molding product having plating layer MITSUBISHI ENG PLASTICS CORP 2014-02-19 CN disclosed
CN-103443328-A Thermoplastic resin composition, resin molding, and process for producing resin molding having plating layer attached thereto MITSUBISHI CHEMICAL EUROPE GMBH 2013-12-11 CN disclosed
CN-103403063-A Polyamide and polyamide composition ASAHI KASEI CHEMICALS CORP (JP) 2013-11-20 CN disclosed
CN-102482415-B Polyamide and polyamide composition ASAHI KASEI CHEMICALS CORP (JP) 2013-11-06 CN disclosed