SCHEMBL21662885

SCHEMBL21662885

c1cc2c3c(cccc3c1)OCC2

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 1/20 0.41
TSHR P16473 1/20 0.41
ITGB2 P05107 1/20 0.41
ICAM1 P05362 1/20 0.41
ITGAL P20701 1/20 0.41
HSD17B10 Q99714 2/20 0.40
KDM4E B2RXH2 2/20 0.40
TYMS P04818 2/20 0.40
ALDH1A1 P00352 1/20 0.40
CYP1A2 P05177 1/20 0.40
HPGD P15428 1/20 0.40
CYP2C19 P33261 1/20 0.40
LMNA P02545 3/20 0.39
DYRK1A Q13627 3/20 0.39
PARP1 P09874 1/20 0.38
PRKCI P41743 1/20 0.38
SMN1; SMN2 Q16637 3/20 0.37
CRHBP P24387 2/20 0.37
CRHR2 Q13324 2/20 0.37
HTT P42858 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14373225 0.80 HSD17B10 (0.59) CYP3A4TSHRITGB2ICAM1ITGAL
SCHEMBL335161 0.75
SCHEMBL29373453 0.75
SCHEMBL33192 0.75
SCHEMBL9098245 0.73 ITGB2 (0.55) TSHRITGB2ICAM1ITGALLMNA
Water SCHEMBL28018355 0.73 ITGB2 (0.55) TSHRITGB2ICAM1ITGALLMNA
SCHEMBL28287702 0.73
SCHEMBL30335609 0.73 ITGB2 (0.55) TSHRITGB2ICAM1ITGALLMNA
Methane SCHEMBL28208258 0.73 ITGB2 (0.55) TSHRITGB2ICAM1ITGALLMNA
SCHEMBL1652999 0.72 DYRK1A (0.43) ITGB2ICAM1ITGALLMNADYRK1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-20200041903-A1 POLYMER HAVING A STRUCTURE OF POLYAMIDE, POLYAMIDE-IMIDE, OR POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, PHOTOSENSITIVE DRY FILM, AND PROTECTIVE FILM FOR ELECTRIC AND ELECTRONIC PARTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-02-06 US disclosed