SCHEMBL2174498

SCHEMBL2174498

O=C(O)c1ccc2c(C(=O)O)cccc2c1C(=O)OC(=O)c1c(C(=O)O)ccc2c(C(=O)O)cccc12

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NR4A1 P22736 1/20 0.48
NR4A2 P43354 1/20 0.48
NR4A3 Q92570 1/20 0.48
PTPN1 P18031 1/20 0.42
CDC25B P30305 2/20 0.41
ALDH1A1 P00352 2/20 0.40
PRNP P04156 1/20 0.40
ALOX15 P16050 1/20 0.40
TYMS P04818 1/20 0.40
PARP1 P09874 1/20 0.38
WDR5 P61964 1/20 0.38
KDM4E B2RXH2 4/20 0.37
TSHR P16473 2/20 0.37
LDHA P00338 1/20 0.37
CYP2C9 P11712 1/20 0.37
HPGD P15428 1/20 0.37
ALOX12 P18054 1/20 0.37
ATIC P31939 1/20 0.37
HSD17B10 Q99714 1/20 0.37
L3MBTL1 Q9Y468 3/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL9401935 0.98 NR4A1 (0.47) NR4A1NR4A2NR4A3PTPN1CDC25B
SCHEMBL29996206 0.85 NR4A1 (0.55) NR4A1NR4A2NR4A3PTPN1CDC25B
SCHEMBL31401786 0.85 NR4A1 (0.55) NR4A1NR4A2NR4A3PTPN1CDC25B
SCHEMBL464977 0.85 NR4A1 (0.55) NR4A1NR4A2NR4A3PTPN1CDC25B
SCHEMBL2435713 0.85 CYP1A2 (0.41) NR4A1NR4A2NR4A3CDC25BALDH1A1
SCHEMBL2433830 0.83 CYP1A2 (0.39) NR4A1NR4A2NR4A3CDC25BALDH1A1
SCHEMBL21173971 0.83 NR4A1 (0.57) NR4A1NR4A2NR4A3PTPN1CDC25B
SCHEMBL2694305 0.80 HPGD (0.50) NR4A1NR4A2NR4A3CDC25BALDH1A1
SCHEMBL6518298 0.80 NR4A1 (0.50) NR4A1NR4A2NR4A3PTPN1CDC25B
SCHEMBL31284375 0.79 NR4A1 (0.52) NR4A1NR4A2NR4A3CDC25BALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3089170-B1 MULTILAYER INSULATED WIRE, COIL AND ELECTRICAL/ELECTRONIC EQUIPMENT ESSEX FURUKAWA MAGNET WIRE JAPAN CO LTD (JP) 2021-06-02 EP disclosed
US-10032540-B2 Multilayer insulated wire, coil, and electrical/electronic equipment FURUKAWA ELECTRIC CO., LTD. (JP) 2018-07-24 US disclosed
EP-3089170-A1 MULTILAYER INSULATED WIRE, COIL AND ELECTRICAL/ELECTRONIC DEVICE Furukawa Electric Co., Ltd. (JP) 2016-11-02 EP disclosed
US-20160307664-A1 MULTILAYER INSULATED WIRE, COIL, AND ELECTRICAL/ELECTRONIC EQUIPMENT FURUKAWA ELECTRIC CO., LTD. (JP) 2016-10-20 US disclosed
US-8449200-B2 Resin composition for sliding member and rolling bearing NTN CORPORATION (JP) 2013-05-28 US disclosed
US-8293847-B2 Film-like adhesive, adhesive sheet, and semiconductor device using same HITACHI CHEMICAL CO., LTD. (JP) 2012-10-23 US disclosed
US-8182155-B2 Lubricating grease and lubricating grease-enclosed roller bearing NTN CORPORATION (JP) 2012-05-22 US disclosed
US-7973122-B2 Polyamideimide compositions having multifunctional core structures GENERAL CABLE TECHNOLOGIES CORPORATION (US) 2011-07-05 US disclosed
US-20100239858-A1 FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING SAME HITACHI CHEMICAL CO., LTD., (JP) 2010-09-23 US disclosed
US-20100142872-A1 RESIN COMPOSITION FOR SLIDING MEMBER AND ROLLING BEARING NTN CORPORATION (JP) 2010-06-10 US disclosed
EP-1956072-A1 LUBRICATING GREASE AND LUBRICATING-GREASE-FILLED ROLLER BEARING NTN CORPORATION (JP) 2008-08-13 EP disclosed
US-20080160304-A1 Polyamideimide compositions having multifunctional core structures GENERAL CABLE TECHNOLOGIES 2008-07-03 US disclosed
US-20050282010-A1 Polyamideimide compositions having multifunctional core structures GENERAL CABLE TECHNOLOGIES CORPORATION 2005-12-22 US disclosed
US-5840802-A HEAT RESISTANCE AND IMPACT STRENGTH FOR THERMOPLASTIC RESINS GENERAL ELECTRIC COMPANY (US) 1998-11-24 US disclosed
EP-0289955-B2 Use of an insulated wire for direct solderimg DAINICHISEIKA COLOR CHEM (JP) 1996-07-17 EP disclosed
US-5342739-A Coating a substrate with a polyamic acid modified by an amino- or hydroxy-substituted phenol; shelf life CHISSO CORPORATION (JP) 1994-08-30 US disclosed
US-5306785-A Molding materials GENERAL ELECTRIC COMPANY (US) 1994-04-26 US disclosed
EP-0537014-A2 Dual graft stage and thermally stabilized polyorganisiloxane/polyvinyl-based graft copolymers and thermoplastic compositions containing the same GENERAL ELECTRIC COMPANY (US) 1993-04-14 EP disclosed
EP-0526650-A1 PHOTOSENSITIVE POLYMER COMPOSITION AND PATTERN FORMATION CHISSO CORPORATION (JP) 1993-02-10 EP disclosed
US-4921761-A Polyester imide resins DAINICHISEIKA COLOR & CHEMICALS MFG. CO., LTD. (JP) 1990-05-01 US disclosed