SCHEMBL21753922

SCHEMBL21753922

CCCCCCOC(=O)CCSCCC(=O)OCCCCCC

nearest known ligand 0.62

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.62
DGKA P23743 1/20 0.62
HTR2C P28335 1/20 0.59
PLA2G4B P0C869 1/20 0.54
RAD52 P43351 1/20 0.53
NPSR1 Q6W5P4 1/20 0.53
PRSS1 P07477 1/20 0.53
PRSS2 P07478 1/20 0.53
PRSS3 P35030 1/20 0.53
FAAH O00519 1/20 0.51
DNM1 Q05193 1/20 0.51
EPHX1 P07099 1/20 0.48
TSHR P16473 2/20 0.47
PAM P19021 2/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL385290 1.00 NAAA (0.62) NAAADGKAHTR2CPLA2G4BRAD52
SCHEMBL6839694 1.00 NAAA (0.62) NAAADGKAHTR2CPLA2G4BRAD52
SCHEMBL4275603 1.00 NAAA (0.62) NAAADGKAHTR2CPLA2G4BRAD52
SCHEMBL16267108 1.00 NAAA (0.62) NAAADGKAHTR2CPLA2G4BRAD52
SCHEMBL74624 1.00 NAAA (0.62) NAAADGKAHTR2CPLA2G4BRAD52
SCHEMBL110693 1.00 NAAA (0.62) NAAADGKAHTR2CPLA2G4BRAD52
SCHEMBL5014079 1.00 NAAA (0.62) NAAADGKAHTR2CPLA2G4BRAD52
SCHEMBL112309 1.00 NAAA (0.62) NAAADGKAHTR2CPLA2G4BRAD52
SCHEMBL5012945 1.00 NAAA (0.62) NAAADGKAHTR2CPLA2G4BRAD52
SCHEMBL5016250 1.00 NAAA (0.62) NAAADGKAHTR2CPLA2G4BRAD52

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220326613-A1 PHOTOSENSITIVE TRANSFER MATERIAL AND METHOD OF PRODUCING THE SAME, METHOD OF PRODUCING PATTERNED METAL CONDUCTIVE MATERIAL, FILM, TOUCH PANEL, METHOD OF SUPPRESSING DETERIORATION, AND LAMINATE FUJIFILM CORPORATION (JP) 2022-10-13 US disclosed
WO-2020040249-A1 HEAT-RESISTANT RELEASE AGENT COMPOSITION 株式会社ネオス 2020-02-27 WO disclosed