SCHEMBL21769097

SCHEMBL21769097

C=Cc1ccc2cc(-c3cccc(O)c3)ccc2n1

nearest known ligand 0.53

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
HSD17B2 P37059 10/20 0.53
HSD17B1 P14061 9/20 0.53
ESR1 P03372 5/20 0.53
ESR2 Q92731 5/20 0.53
CYP3A4 P08684 4/20 0.53
CYP2C9 P11712 4/20 0.53
CYP1A2 P05177 3/20 0.53
CYP2D6 P10635 3/20 0.53
CYP2B6 P20813 3/20 0.53
CYP2C19 P33261 3/20 0.53
SRC P12931 1/20 0.46
PIK3CD O00329 1/20 0.44
PIK3CA P42336 1/20 0.44
PIK3CB P42338 1/20 0.44
PIK3CG P48736 1/20 0.44
CYSLTR2 Q9NS75 1/20 0.44
CYSLTR1 Q9Y271 1/20 0.44
MAP4K4 O95819 1/20 0.41
BACE1 P56817 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31505363 0.82 ESR2 (0.50) ESR1ESR2CYP3A4CYP1A2CYSLTR2
Formamide SCHEMBL9731189 0.75 PFKFB3 (0.51) ESR1ESR2CYP1A2CYSLTR2CYSLTR1
SCHEMBL31316500 0.73 HSD17B2 (0.60) HSD17B2HSD17B1ESR1ESR2CYP3A4
SCHEMBL30530215 0.73 HSD17B2 (0.53) HSD17B2HSD17B1ESR1ESR2CYP3A4
SCHEMBL28378971 0.73 HSD17B2 (0.53) HSD17B2HSD17B1ESR1ESR2CYP3A4
SCHEMBL21751200 0.73 HSD17B2 (0.53) HSD17B2HSD17B1ESR1ESR2CYP3A4
SCHEMBL2124794 0.70 ESR1 (1.00) HSD17B2HSD17B1ESR1ESR2CYP3A4
SCHEMBL3007819 0.69 ESR1 (0.71) HSD17B2HSD17B1ESR1ESR2CYP3A4
SCHEMBL3015094 0.69 HSD17B1 (1.00) HSD17B2HSD17B1ESR1ESR2CYP3A4
SCHEMBL3927261 0.69 ESR1 (1.00) HSD17B2HSD17B1ESR1ESR2CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200062875-A1 POLYMER, ORGANIC LAYER COMPOSITION AND METHOD OF FORMING PATTERNS SAMSUNG SDI CO., LTD. (KR) 2020-02-27 US disclosed