SCHEMBL21794101

SCHEMBL21794101

COc1cccc(-c2cc(-c3cccc(OC)c3)c(S(=O)(=O)O)c(-c3cccc(OC)c3)c2)c1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HDAC4 P56524 1/20 0.50
▸ HDAC8 Q9BY41 1/20 0.50
▸ CYP1A1 P04798 1/20 0.49
▸ CYP1A2 P05177 1/20 0.49
▸ CYP2E1 P05181 1/20 0.49
▸ CYP3A4 P08684 1/20 0.49
▸ CYP2C8 P10632 1/20 0.49
▸ CYP2D6 P10635 1/20 0.49
▸ CYP2A6 P11509 1/20 0.49
▸ CYP2C9 P11712 1/20 0.49
▸ CYP4B1 P13584 1/20 0.49
▸ CYP2B6 P20813 1/20 0.49
▸ CYP3A5 P20815 1/20 0.49
▸ CYP2A7 P20853 1/20 0.49
▸ CYP3A7 P24462 1/20 0.49
▸ CYP2F1 P24903 1/20 0.49
▸ CYP2C18 P33260 1/20 0.49
▸ CYP2C19 P33261 1/20 0.49
▸ CYP2J2 P51589 1/20 0.49
▸ CYP4F2 P78329 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28753689 0.80 ERN1 (0.51) HDAC4HDAC8ERN1EDNRBEDNRA
SCHEMBL21794146 0.79 SMN1; SMN2 (0.50) HDAC4HDAC8CYP1A2CYP2D6CYP2C9
SCHEMBL2943584 0.78 PLAU (0.57) HDAC4HDAC8CYP1A1CYP1A2CYP2E1
SCHEMBL29489425 0.75 CYP3A4 (0.73) HDAC4HDAC8CYP1A1CYP1A2CYP2E1
SCHEMBL196765 0.75 CYP3A4 (0.73) HDAC4HDAC8CYP1A1CYP1A2CYP2E1
SCHEMBL2315622 0.75 MAOB (0.49) HDAC4HDAC8ALKBH3SLC22A12ALDH1A1
SCHEMBL30689257 0.73 ALKBH3 (0.62) HDAC4HDAC8CYP1A1CYP1A2CYP2E1
SCHEMBL5620245 0.73 CYP3A4 (0.86) HDAC4HDAC8CYP1A1CYP1A2CYP2E1
SCHEMBL29628977 0.73 CYP3A4 (0.77) HDAC4HDAC8CYP1A1CYP1A2CYP2E1
Ammonia Solution, Strong SCHEMBL27960505 0.73 CYP3A4 (0.70) HDAC4HDAC8CYP1A1CYP1A2CYP2E1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023162837-A1 POSITIVE ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND COMPOUND 富士フイルム株式会社 2023-08-31 — — WO disclosed
WO-2023162838-A1 ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD 富士フイルム株式会社 2023-08-31 — — WO disclosed
WO-2023008347-A1 ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING ELECTRONIC DEVICE 富士フイルム株式会社 2023-02-02 — — WO disclosed
US-20210165325-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND FUJIFILM CORPORATION (JP) 2021-06-03 — — US disclosed
WO-2020045534-A1 ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND 富士フイルム株式会社 2020-03-05 — — WO disclosed
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