Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 5/20 | 0.47 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.47 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 8/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.42 |
| ▸ | TP53 | P04637 | 4/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.33 |
| ▸ | GLA | P06280 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 2/20 | 0.31 |
| ▸ | HPGD | P15428 | 2/20 | 0.31 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.31 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.31 |
| ▸ | PPARG | P37231 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15797057 | 0.91 | TSHR (0.50) | TSHRMAPK1SMN1; SMN2ALDH1A1TDP1 | |
| Isopropyl Alcohol SCHEMBL27564110 | 0.89 | TSHR (0.52) | TSHRMAPK1SMN1; SMN2ALDH1A1TDP1 | |
| SCHEMBL1946788 | 0.89 | TSHR (0.52) | TSHRMAPK1SMN1; SMN2ALDH1A1TDP1 | |
| SCHEMBL9792647 | 0.84 | TSHR (0.48) | TSHRMAPK1SMN1; SMN2ALDH1A1TDP1 | |
| Cyclohexane SCHEMBL27838990 | 0.84 | TSHR (0.48) | TSHRMAPK1SMN1; SMN2ALDH1A1TDP1 | |
| SCHEMBL27911873 | 0.84 | TSHR (0.48) | TSHRMAPK1SMN1; SMN2ALDH1A1TDP1 | |
| Isobutane SCHEMBL1759584 | 0.84 | TSHR (0.56) | TSHRMAPK1SMN1; SMN2ALDH1A1TDP1 | |
| SCHEMBL6310699 | 0.83 | TSHR (0.47) | TSHRMAPK1SMN1; SMN2ALDH1A1TDP1 | |
| Propylene Glycol SCHEMBL2120984 | 0.83 | TSHR (0.47) | TSHRMAPK1SMN1; SMN2ALDH1A1TDP1 | |
| Butanol SCHEMBL20190006 | 0.83 | SMN1; SMN2 (0.50) | TSHRMAPK1SMN1; SMN2ALDH1A1TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117795002-A | Epoxy resin composition, liquid compression molding material, top encapsulation material, and semiconductor device | 纳美仕有限公司 | 2024-03-29 | — | — | CN | disclosed |
| EP-3620481-B1 | LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPARATUS | RESONAC CORP (JP) | 2024-03-27 | — | — | EP | disclosed |
| US-20230399479-A1 | LAMINATED FILM AND FLEXIBLE DEVICE | DAICEL CORPORATION (JP) | 2023-12-14 | — | — | US | disclosed |
| CN-116438066-A | Laminated film and flexible device | 株式会社大赛璐 | 2023-07-14 | — | — | CN | disclosed |
| US-20230203236-A1 | LIQUID COMPRESSION MOLDING MATERIAL | NAMICS CORPORATION (JP) | 2023-06-29 | — | — | US | disclosed |
| WO-2023089878-A1 | EPOXY RESIN COMPOSITION, LIQUID COMPRESSION MOLD MATERIAL, GLOB-TOP MATERIAL, AND SEMICONDUCTOR DEVICE | ナミックス株式会社 | 2023-05-25 | — | — | WO | disclosed |
| US-20200194325-A1 | LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPARATUS | RESONAC CORPORATION (JP) | 2020-06-18 | — | — | US | disclosed |
| US-20200181392-A1 | LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT APPARATUS | RESONAC CORPORATION (JP) | 2020-06-11 | — | — | US | disclosed |
| EP-3636688-A1 | LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2020-04-15 | — | — | EP | disclosed |
| EP-3620481-A1 | LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2020-03-11 | — | — | EP | disclosed |
| CN-110785451-A | Liquid resin composition for sealing and electronic component device | 日立化成株式会社 | 2020-02-11 | — | — | CN | disclosed |
| CN-110770275-A | Liquid resin composition for compression molding and electronic component device | 日立化成株式会社 | 2020-02-07 | — | — | CN | disclosed |