Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.60 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.59 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.59 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.53 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.38 |
| ▸ | SPHK2 | Q9NRA0 | 7/20 | 0.38 |
| ▸ | SPHK1 | Q9NYA1 | 6/20 | 0.38 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1402365 | 0.98 | TSHR (0.62) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL1402713 | 0.93 | TSHR (0.59) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL10754352 | 0.91 | TSHR (0.67) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL22555764 | 0.88 | TSHR (0.62) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL24554552 | 0.87 | ALDH1A1 (0.64) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL28525794 | 0.87 | ALDH1A1 (0.59) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL17559518 | 0.87 | ALDH1A1 (0.59) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL10942290 | 0.87 | ALDH1A1 (0.59) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL10942415 | 0.87 | ALDH1A1 (0.59) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL10943444 | 0.87 | ALDH1A1 (0.59) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3620481-B1 | LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPARATUS | RESONAC CORP (JP) | 2024-03-27 | — | — | EP | disclosed |
| US-20230399479-A1 | LAMINATED FILM AND FLEXIBLE DEVICE | DAICEL CORPORATION (JP) | 2023-12-14 | — | — | US | disclosed |
| US-20230203236-A1 | LIQUID COMPRESSION MOLDING MATERIAL | NAMICS CORPORATION (JP) | 2023-06-29 | — | — | US | disclosed |
| WO-2023089878-A1 | EPOXY RESIN COMPOSITION, LIQUID COMPRESSION MOLD MATERIAL, GLOB-TOP MATERIAL, AND SEMICONDUCTOR DEVICE | ナミックス株式会社 | 2023-05-25 | — | — | WO | disclosed |
| CN-111253893-B | Photocurable adhesive, polarizing plate, and laminated optical member | 住友化学株式会社 | 2023-03-28 | — | — | CN | disclosed |
| WO-2021261064-A1 | LIQUID COMPRESSION MOLDING MATERIAL | ナミックス株式会社 | 2021-12-30 | — | — | WO | disclosed |
| CN-108474896-B | Photocurable adhesive, and polarizing plate and laminated optical member using same | 住友化学株式会社 | 2021-10-08 | — | — | CN | disclosed |
| CN-107090259-B | Photocurable adhesive, and polarizing plate and laminated optical member using same | 住友化学株式会社 | 2021-06-01 | — | — | CN | disclosed |
| US-20200194325-A1 | LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPARATUS | RESONAC CORPORATION (JP) | 2020-06-18 | — | — | US | disclosed |
| US-20200181392-A1 | LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT APPARATUS | RESONAC CORPORATION (JP) | 2020-06-11 | — | — | US | disclosed |
| CN-111253893-A | Photocurable adhesive, polarizing plate, and laminated optical member | 住友化学株式会社 | 2020-06-09 | — | — | CN | disclosed |
| EP-3636688-A1 | LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2020-04-15 | — | — | EP | disclosed |
| EP-3620481-A1 | LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2020-03-11 | — | — | EP | disclosed |
| CN-110785451-A | Liquid resin composition for sealing and electronic component device | 日立化成株式会社 | 2020-02-11 | — | — | CN | disclosed |
| CN-110770275-A | Liquid resin composition for compression molding and electronic component device | 日立化成株式会社 | 2020-02-07 | — | — | CN | disclosed |