Acetophenone

Acetophenone

SCHEMBL21820165

C(OCC1CO1)C1CO1.CC(=O)c1ccccc1.Oc1ccccc1.Oc1ccccc1

nearest known ligand 0.47

Full drug profile on Sugi Atlas →

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.42
MGLL Q99685 4/20 0.42
MAOB P27338 2/20 0.41
ALDH1A1 P00352 2/20 0.40
HTT P42858 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
L3MBTL1 Q9Y468 1/20 0.40
GLA P06280 1/20 0.40
LMNA P02545 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phenol SCHEMBL6444166 0.91 TDP1 (0.47) TDP1MGLLALDH1A1GLA
Benzophenone SCHEMBL28954450 0.88 MEN1 (0.46) TDP1MGLLALDH1A1L3MBTL1LMNA
Phenol SCHEMBL27861395 0.86 TDP1 (0.52) TDP1MGLLALDH1A1SMN1; SMN2GLA
Phenol SCHEMBL27686847 0.86 TDP1 (0.55) TDP1MGLLALDH1A1SMN1; SMN2GLA
Phenol SCHEMBL88310 0.86 TDP1 (0.55) TDP1MGLLALDH1A1SMN1; SMN2GLA
Phenol SCHEMBL29031478 0.86 TDP1 (0.55) TDP1MGLLALDH1A1SMN1; SMN2GLA
Phenol SCHEMBL33409 0.86 TDP1 (0.55) TDP1MGLLALDH1A1SMN1; SMN2GLA
Phenol SCHEMBL28186829 0.86 TDP1 (0.55) TDP1MGLLALDH1A1SMN1; SMN2GLA
Phenol SCHEMBL28072088 0.85 ALDH1A1 (0.47) TDP1MGLLALDH1A1GLA
Phenol SCHEMBL29239071 0.84 TDP1 (0.50) TDP1MGLLALDH1A1SMN1; SMN2GLA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114222779-B Polyorganosiloxane containing epoxy group, curable resin composition containing the same, and cured product thereof 三菱化学株式会社 2024-06-18 CN disclosed
CN-118076485-A Laminate, epoxy film, and wound body 三菱化学株式会社 2024-05-24 CN disclosed
CN-117580909-A Conductive resin composition, high thermal conductive material, and semiconductor device 住友电木株式会社 2024-02-20 CN disclosed
EP-4023694-B1 EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, CURABLE RESIN COMPOSITION CONTAINING EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, AND CURED PRODUCT OF SAME MITSUBISHI CHEM CORP (JP) 2024-02-14 EP disclosed
US-11787898-B2 Epoxy resin, epoxy resin-containing composition and cured product thereof MITSUBISHI CHEMICAL CORPORATION (JP) 2023-10-17 US disclosed
WO-2023140256-A1 MODIFIED EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF 三菱ケミカル株式会社 2023-07-27 WO disclosed
WO-2023063155-A1 LAMINATE BODY, EPOXY FILM AND WOUND BODY 三菱ケミカル株式会社 2023-04-20 WO disclosed
CN-110662782-B Epoxy resin, composition containing epoxy resin, and cured product thereof 三菱化学株式会社 2022-07-22 CN disclosed
EP-4023694-A1 EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, CURABLE RESIN COMPOSITION CONTAINING EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, AND CURED PRODUCT OF SAME Mitsubishi Chemical Corporation (JP) 2022-07-06 EP disclosed
US-20220153933-A1 POLYORGANOSILOXANE WITH EPOXY GROUP, CURABLE RESIN COMPOSITION CONTAINING POLYORGANOSILOXANE WITH EPOXY GROUP, AND CURED PRODUCT THEREOF MITSUBISHI CHEMICAL CORPORATION (JP) 2022-05-19 US disclosed
CN-114222779-A Epoxy group-containing polyorganosiloxane, curable resin composition containing epoxy group-containing polyorganosiloxane, and cured product thereof 三菱化学株式会社 2022-03-22 CN disclosed
EP-3632951-B1 EPOXY RESIN, EPOXY RESIN-CONTAINING COMPOSITION AND CURED PRODUCT THEREOF MITSUBISHI CHEM CORP (JP) 2021-10-06 EP disclosed
CN-112694599-A Phenoxy resin, method for producing same, resin composition thereof, and cured product 日铁化学材料株式会社 2021-04-23 CN disclosed
EP-3760660-A1 EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, CURABLE RESIN COMPOSITION CONTAINING EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, AND CURED PRODUCT OF SAME Mitsubishi Chemical Corporation (JP) 2021-01-06 EP disclosed
US-20200377662-A1 EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, CURABLE RESIN COMPOSITION CONTAINING EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, AND CURED PRODUCT THEREOF MITSUBISHI CHEMICAL CORPORATION (JP) 2020-12-03 US disclosed
EP-3632951-A1 EPOXY RESIN, EPOXY RESIN-CONTAINING COMPOSITION AND CURED PRODUCT OF SAME Mitsubishi Chemical Corporation (JP) 2020-04-08 EP disclosed
US-20200087442-A1 EPOXY RESIN, EPOXY RESIN-CONTAINING COMPOSITION AND CURED PRODUCT THEREOF MITSUBISHI CHEMICAL CORPORATION (JP) 2020-03-19 US disclosed
CN-110662782-A Epoxy resin, composition containing epoxy resin, and cured product thereof 三菱化学株式会社 2020-01-07 CN disclosed