SCHEMBL21829134

SCHEMBL21829134

CC[Si](C)(OC)OCC1CCC2OC2C1

nearest known ligand 0.31

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
PPM1B O75688 2/20 0.31
PTPN1 P18031 2/20 0.31
PPP1CC P36873 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28163244 0.84 PTGS1 (0.32) PPM1BPTPN1PPP1CC
SCHEMBL1141024 0.84
SCHEMBL27727267 0.83
SCHEMBL28274874 0.81
SCHEMBL188406 0.81 PTGS1 (0.30)
Cyclohexane SCHEMBL28213993 0.81
SCHEMBL2826568 0.78
SCHEMBL5613831 0.78 PTGS1 (0.32) PPM1BPTPN1PPP1CC
SCHEMBL2826951 0.76 LMNA (0.30)
SCHEMBL6424775 0.75 PTGS1 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112789339-B Formaldehyde-free, safe binder formulations for textile, non-textile and particulate materials 盛禧奥欧洲有限责任公司 2023-07-18 CN claimed
CN-119998395-A Two-component composition based on epoxide mixtures 汉高股份有限及两合公司 2025-05-13 CN disclosed
CN-119487096-A Functionalized polymeric materials for forming nitric oxide and methods thereof 斯特里莱国家有限责任公司 2025-02-18 CN disclosed
CN-112789339-B Formaldehyde-free, safe binder formulations for textile, non-textile and particulate materials 盛禧奥欧洲有限责任公司 2023-07-18 CN disclosed
CN-109311917-B Process for preparing alkoxysilanes 莫门蒂夫性能材料股份有限公司 2021-08-10 CN disclosed
WO-2020071363-A1 ADHESIVE COMPOSITION USING IMIDE BOND-CONTAINING RESIN AND PHOSPHOROUS COMPOUND 東洋紡株式会社 2020-04-09 WO disclosed
WO-2020071364-A1 ADHESIVE COMPOSITION USING IMIDE BOND-CONTAINING RESIN AND PHOSPHOROUS COMPOUND 東洋紡株式会社 2020-04-09 WO disclosed
CN-108068561-B Cavity Noise reduction tire 韩国轮胎株式会社 2019-11-26 CN disclosed
CN-110402483-A Semiconductor element, compensated semiconductor device, the manufacturing method of semiconductor element, wireless communication device and Commercial goods labels TORAY INDUSTRIES 2019-11-01 CN disclosed
CN-110088206-A The protective agent or adhesive composition of curable organopolysiloxane composition and electric and electronic components 陶氏东丽株式会社 2019-08-02 CN disclosed
CN-109311917-A The preparation method of alkoxy silane 莫门蒂夫性能材料股份有限公司 2019-02-05 CN disclosed
CN-108475642-A N-type semiconductor element and compensated semiconductor device and its manufacturing method and use its wireless telecom equipment 东丽株式会社 2018-08-31 CN disclosed
CN-108140484-A Capacitor and its manufacturing method and use its wireless communication apparatus 东丽株式会社 2018-06-08 CN disclosed
CN-104789111-B Oligoaniline compound 日产化学工业株式会社 2018-05-01 CN disclosed
CN-107835952-A The manufacture method of heat ray reflecting material and window and heat ray reflecting material 富士胶片株式会社 2018-03-23 CN disclosed
CN-104821375-B Oligoaniline compound 日产化学工业株式会社 2018-03-02 CN disclosed
CN-107001879-A OLED compatibility adhesive comprising silane water scavenger 德莎欧洲公司 2017-08-01 CN disclosed
CN-106255727-A Fluid composition and antibacterial articles 旭硝子株式会社 2016-12-21 CN disclosed
CN-105612235-A Sealing material composition and composite glass YOKOHAMA RUBBER CO LTD 2016-05-25 CN disclosed