SCHEMBL21829137

SCHEMBL21829137

C=C(C)C(=O)[SiH3].CO[Si](CCC1CCC2OC2C1)(OC)OC

nearest known ligand 0.31

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 1/20 0.31
PTGS2 P35354 1/20 0.31
PPM1B O75688 1/20 0.31
PTPN1 P18031 1/20 0.31
PPP1CC P36873 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16390955 0.89
SCHEMBL48081 0.85 PTGS1 (0.35) PTGS1PTGS2
SCHEMBL4878967 0.85 PTGS1 (0.35) PTGS1PTGS2
SCHEMBL16020793 0.85 PTGS1 (0.35) PTGS1PTGS2
SCHEMBL20478201 0.85 PTGS1 (0.35) PTGS1PTGS2
SCHEMBL9936543 0.84 TSHR (0.36) PTGS1PTGS2
SCHEMBL28206891 0.83 ALDH1A1 (0.32)
SCHEMBL8740651 0.83 PTGS1 (0.33) PTGS1PTGS2
SCHEMBL8863307 0.83 PTGS1 (0.33) PTGS1PTGS2
SCHEMBL28274253 0.83 PTGS1 (0.34) PTGS1PTGS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020071363-A1 ADHESIVE COMPOSITION USING IMIDE BOND-CONTAINING RESIN AND PHOSPHOROUS COMPOUND 東洋紡株式会社 2020-04-09 WO disclosed
WO-2020071364-A1 ADHESIVE COMPOSITION USING IMIDE BOND-CONTAINING RESIN AND PHOSPHOROUS COMPOUND 東洋紡株式会社 2020-04-09 WO disclosed