Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PTGS1 | P23219 | 13/20 | 0.70 |
| ▸ | PTGS2 | P35354 | 12/20 | 0.70 |
| ▸ | ALOX5 | P09917 | 7/20 | 0.70 |
| ▸ | NQO2 | P16083 | 3/20 | 0.48 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.45 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.45 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.45 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.45 |
| ▸ | CYP2B6 | P20813 | 1/20 | 0.45 |
| ▸ | TTR | P02766 | 1/20 | 0.45 |
| ▸ | EGFR | P00533 | 1/20 | 0.44 |
| ▸ | ERBB2 | P04626 | 1/20 | 0.44 |
| ▸ | CA1 | P00915 | 1/20 | 0.44 |
| ▸ | CA2 | P00918 | 1/20 | 0.44 |
| ▸ | ESR1 | P03372 | 1/20 | 0.43 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.43 |
| ▸ | EEF2K | O00418 | 1/20 | 0.42 |
| ▸ | SRC | P12931 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2182990 | 1.00 | PTGS1 (0.70) | PTGS1PTGS2ALOX5NQO2CYP2C9 | |
| SCHEMBL8398356 | 0.90 | PTGS1 (0.59) | PTGS1PTGS2ALOX5NQO2CYP2C9 | |
| SCHEMBL8398353 | 0.90 | PTGS1 (0.59) | PTGS1PTGS2ALOX5NQO2CYP2C9 | |
| SCHEMBL14173720 | 0.81 | PTGS1 (0.53) | PTGS1PTGS2ALOX5CYP2C9CYP1A2 | |
| SCHEMBL8422593 | 0.80 | PTGS1 (0.49) | PTGS1PTGS2ALOX5NQO2CYP3A4 | |
| SCHEMBL8422595 | 0.80 | PTGS1 (0.49) | PTGS1PTGS2ALOX5NQO2CYP3A4 | |
| SCHEMBL9439964 | 0.75 | PTGS1 (0.45) | PTGS1PTGS2ALOX5NQO2CYP1A2 | |
| SCHEMBL9439959 | 0.75 | PTGS1 (0.45) | PTGS1PTGS2ALOX5NQO2CYP1A2 | |
| SCHEMBL16192285 | 0.74 | PTGS1 (0.73) | PTGS1PTGS2ALOX5NQO2EGFR | |
| SCHEMBL16192287 | 0.74 | PTGS1 (0.73) | PTGS1PTGS2ALOX5NQO2EGFR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-10338682-A | — | — | None | — | — | JP | disclosed |
| US-20110163461-A1 | ELECTRONIC PACKAGING | EVONIK DEGUSSA GMBH (DE) | 2011-07-07 | — | — | US | disclosed |
| EP-0869140-B1 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL CO (JP) | 2003-08-13 | — | — | EP | disclosed |
| US-6255409-B1 | EPOXY RESIN COMPOSITION COMPRISING BIFUNCTIONAL CRYSTALLINE EPOXY COMPOUND, AMORPHOUS TRISPHENOLMETHANE TYPE EPOXY COMPOUND HAVING THREE OR MORE EPOXY GROUPS IN MOLECULE, AND EPOXY CURING AGENT HAVING PHENOLIC HYDROXYL GROUPS | SUMITOMO CHEMICAL CO., LTD. (JP) | 2001-07-03 | — | — | US | disclosed |
| US-6190786-B1 | BIS(GLYCIDYLOXY)STILBENE RESINS | SUMITOMO CHEMICAL COMPANY, LTD. (JP) | 2001-02-20 | — | — | US | disclosed |
| EP-0379057-B1 | Mesogenic epoxy compounds | DOW CHEMICAL CO (US) | 2000-12-06 | — | — | EP | disclosed |
| JP-H10338682-A | EPOXY COMPOUND, ITS PRODUCTION, EPOXY RESIN COMPOSITION AND RESIN SEALING TYPE SEMICONDUCTOR DEVICE | SUMITOMO CHEM CO LTD | 1998-12-22 | — | — | JP | disclosed |
| EP-0869140-A2 | Epoxy resin composition and resin-encapsulated semiconductor device | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-10-07 | — | — | EP | disclosed |
| US-5736620-A | ENHANCED UNIDIRECTIONAL, MECHANICAL PROPERTIES AT LOWER TEMPERATURE | THE DOW CHEMICAL COMPANY (US) | 1998-04-07 | — | — | US | disclosed |
| US-5463091-A | Liquid crystals, polyepoxides | THE DOW CHEMICAL COMPANY (US) | 1995-10-31 | — | — | US | disclosed |
| US-5292831-A | Enhanced unidirectional, mechanical properties | THE DOW CHEMICAL COMPANY (US) | 1994-03-08 | — | — | US | disclosed |
| US-5270405-A | Mesogenic epoxy compounds | THE DOW CHEMICAL COMPANY (US) | 1993-12-14 | — | — | US | disclosed |
| US-5270404-A | Curable compositions of mesogen-containing advanced epoxy resins and curing agents therefor | THE DOW CHEMICAL COMPANY (US) | 1993-12-14 | — | — | US | disclosed |
| US-5266660-A | Curable compositions containing mesogenic epoxy compounds and cured products thereof | THE DOW CHEMICAL CO. (US) | 1993-11-30 | — | — | US | disclosed |
| US-5248740-A | Thioepoxides, liquid crystal polymers | THE DOW CHEMICAL COMPANY (US) | 1993-09-28 | — | — | US | disclosed |
| US-5227452-A | Curable mixtures of mesogenic epoxy resins and mesogenic polyamines and cured compositions | THE DOW CHEMICAL COMPANY (US) | 1993-07-13 | — | — | US | disclosed |
| US-5218062-A | Curable mixtures of mesogenic epoxy resins and mesogenic polyamines and cured compositions | THE DOW CHEMICAL COMPANY (US) | 1993-06-08 | — | — | US | disclosed |
| US-5182340-A | Molding materials having shorter gel time with aliphatic amine curing agents | THE DOW CHEMICAL COMPANY (US) | 1993-01-26 | — | — | US | disclosed |
| EP-0473935-A2 | Curable mixture of mesogenic epoxy resins and mesogenic polyamines and cured compositions | THE DOW CHEMICAL COMPANY (US) | 1992-03-11 | — | — | EP | disclosed |
| EP-0379057-A2 | Mesogenic epoxy compounds | THE DOW CHEMICAL COMPANY (US) | 1990-07-25 | — | — | EP | disclosed |