SCHEMBL218362

SCHEMBL218362

CC[Si](CC)(c1ccc(O)cc1)c1ccc(O)cc1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 12/20 1.00
ESR2 Q92731 8/20 0.54
AR P10275 3/20 0.54
MAPT P10636 4/20 0.42
LMNA P02545 3/20 0.42
CYP3A4 P08684 3/20 0.42
ALOX15 P16050 3/20 0.42
MEN1 O00255 3/20 0.42
KMT2A Q03164 3/20 0.42
ALDH1A1 P00352 2/20 0.42
HIF1A Q16665 2/20 0.42
HSD17B10 Q99714 2/20 0.42
CYP1A2 P05177 2/20 0.42
PGR P06401 2/20 0.42
CHRM2 P08172 2/20 0.42
ADORA3 P0DMS8 2/20 0.42
CYP2D6 P10635 2/20 0.42
CHRM1 P11229 2/20 0.42
CYP2C9 P11712 2/20 0.42
DRD1 P21728 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16537645 0.81 ESR1 (0.68) ESR1ESR2ARMAPTLMNA
SCHEMBL2622739 0.77 ESR1 (0.62) ESR1ESR2ARMAPTLMNA
Hydroquinone SCHEMBL11180188 0.73 LMNA (0.67) ESR1ESR2ARMAPTLMNA
Hydroquinone SCHEMBL3095350 0.73 LMNA (0.67) ESR1ESR2ARMAPTLMNA
Hydroquinone SCHEMBL6071932 0.73 LMNA (0.67) ESR1ESR2ARMAPTLMNA
SCHEMBL2444645 0.72 ESR1 (0.56) ESR1ESR2ARMAPTLMNA
SCHEMBL21722327 0.72 ESR1 (0.56) ESR1ESR2AR
Propane SCHEMBL11439349 0.71 ESR1 (0.73) ESR1ESR2ARMAPTLMNA
Propane SCHEMBL11499965 0.71 ESR1 (0.73) ESR1ESR2ARMAPTLMNA
Propane SCHEMBL9293116 0.71 ESR1 (0.73) ESR1ESR2ARMAPTLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1788433-B1 Silicon-containing film forming composition and substrate processing method SHINETSU CHEMICAL CO (JP) 2014-07-09 EP disclosed
US-8349533-B2 Resist lower-layer composition containing thermal acid generator, resist lower layer film-formed substrate, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-01-08 US disclosed
US-8313890-B2 Antireflective coating composition, antireflective coating, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-11-20 US disclosed
US-8288072-B2 Antireflection film; fast etching speed whcih reduces deformation; accuracy; 2,3-epoxypropyl methacrylate ester-styrene copolymer SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-10-16 US disclosed
US-8088554-B2 Bottom resist layer composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD (JP) 2012-01-03 US disclosed
US-7910283-B2 Silicon-containing antireflective coating forming composition, silicon-containing antireflective coating, substrate processing intermediate, and substrate processing method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-03-22 US disclosed
US-7879530-B2 Antireflective coating composition, antireflective coating, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-02-01 US disclosed
US-7871761-B2 Resist lower layer material, resist lower layer substrate comprising the material and method for forming pattern SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-01-18 US disclosed
US-7745104-B2 Polymer having a hydrocarbon chain backbone and containing units derived from norbornadiene, indene, benzofuran, benzothiophene, acenaphthene, or vinyl pyrene, fluorene, phenanthrene, chrysene, naphthacene, pentacene, or acenaphthene; excellent etching resistance; shorter wavelengths SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-06-29 US disclosed
US-20100151382-A1 Bottom resist layer composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-06-17 US disclosed
US-20060188809-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-08-24 US disclosed
US-20060019195-A1 Photoresist undercoat-forming material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-01-26 US disclosed
US-20060014106-A1 Photoresist undercoat-forming material and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2006-01-19 US disclosed
US-20050282091-A1 Patterning process and undercoat-forming material SHIN-ETSU CHEMICAL CO.,LTD. (JP) 2005-12-22 US disclosed
US-20050277756-A1 Porous film-forming composition, patterning process, and porous sacrificial film SHIN-ETSU CHEMICAL CO., LTD. 2005-12-15 US disclosed
US-20050277058-A1 Antireflective film-forming composition, method for manufacturing the same, and antireflective film and pattern formation method using the same SHIN-ETSU CHEMICAL CO., LTD. 2005-12-15 US disclosed
US-20040259037-A1 Resist lower layer film material and method for forming a pattern SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-12-23 US disclosed
US-20040247900-A1 Antireflective film material, and antireflective film and pattern formation method using the same SHIN-ETSU CHEMICAL CO. LTD. (JP) 2004-12-09 US disclosed
US-20040241577-A1 Resist lower layer film material and method for forming a pattern SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-12-02 US disclosed
US-20040191479-A1 Anti-reflection film material and a substrate having an anti-reflection film and a method for forming a pattern SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-09-30 US disclosed