⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22199435 | 0.80 | — | — | |
| SCHEMBL14396172 | 0.72 | — | — | |
| SCHEMBL106572 | 0.72 | — | — | |
| SCHEMBL15739097 | 0.72 | — | — | |
| SCHEMBL468361 | 0.72 | — | — | |
| SCHEMBL5604565 | 0.70 | — | — | |
| SCHEMBL11933903 | 0.68 | — | — | |
| SCHEMBL372514 | 0.67 | — | — | |
| SCHEMBL14160661 | 0.67 | — | — | |
| SCHEMBL11050460 | 0.66 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10920008-B2 | Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same | TAIWAN UNION TECHNOLOGY CORPORATION (TW) | 2021-02-16 | — | — | US | disclosed |
| US-20200123307-A1 | THERMAL-CURABLE RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME | TAIWAN UNION TECHNOLOGY CORPORATION (TW) | 2020-04-23 | — | — | US | disclosed |