SCHEMBL2187057

SCHEMBL2187057

Oc1cc2ccccc2c2c1O2

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TRPM4 Q8TD43 1/20 0.56
NQO2 P16083 1/20 0.48
CYP1A2 P05177 3/20 0.43
ALOX5 P09917 2/20 0.41
PTPN22 Q9Y2R2 1/20 0.40
ALDH1A1 P00352 4/20 0.39
HSD17B10 Q99714 3/20 0.39
HIF1A Q16665 1/20 0.39
CYP1B1 Q16678 1/20 0.39
IDO1 P14902 1/20 0.39
MEN1 O00255 4/20 0.38
KMT2A Q03164 4/20 0.38
HPGD P15428 3/20 0.38
KDM4E B2RXH2 3/20 0.38
MAPT P10636 2/20 0.38
TYR P14679 1/20 0.38
DAO P14920 1/20 0.38
AKR1B1 P15121 1/20 0.38
MPI P34949 1/20 0.38
POLB P06746 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7823956 0.82 TRPM4 (0.43) TRPM4NQO2CYP1A2ALOX5ALDH1A1
SCHEMBL21130706 0.75 KDM4E (0.41) ALOX5ALDH1A1HSD17B10CYP1B1MEN1
SCHEMBL23861398 0.75 TRPM4 (0.43) TRPM4NQO2CYP1A2ALOX5ALDH1A1
SCHEMBL23861621 0.74 TRPM4 (0.42) TRPM4NQO2CYP1A2ALOX5PTPN22
SCHEMBL1332684 0.73 CYP1A2 (0.43) TRPM4NQO2CYP1A2ALOX5ALDH1A1
SCHEMBL23861557 0.73 TRPM4 (0.41) TRPM4NQO2CYP1A2ALOX5ALDH1A1
SCHEMBL23900972 0.73 KDM4E (0.46) TRPM4NQO2CYP1A2ALDH1A1HIF1A
SCHEMBL508755 0.72 TRPM4 (1.00) TRPM4NQO2CYP1A2ALOX5PTPN22
SCHEMBL29399180 0.72 TRPM4 (1.00) TRPM4NQO2CYP1A2ALOX5PTPN22
SCHEMBL23900989 0.71 TRPM4 (0.40) TRPM4NQO2CYP1A2ALDH1A1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112626508-B Surface treatment liquid for copper or copper alloy plate and preparation method and application thereof 广州三孚新材料科技股份有限公司 2022-11-11 CN claimed
CN-121586750-A Composition for forming silicon-containing underlayer film for directional self-assembly 日产化学株式会社 2026-02-27 CN disclosed
WO-2025041813-A1 COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ASSEMBLY 日産化学株式会社 2025-02-27 WO disclosed
US-20240302744-A1 COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ORGANIZATION NISSAN CHEMICAL CORPORATION (JP) 2024-09-12 US disclosed
CN-118241265-A Tin plating additive composition and plating solution 深圳市睿烯新材料科技有限公司 2024-06-25 CN disclosed
CN-117063129-A Composition for forming silicon-containing underlayer film for directional self-assembly 日产化学株式会社 2023-11-14 CN disclosed
US-11674053-B2 Composition for forming underlayer film of self-assembled film including aliphatic polycyclic structure NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2023-06-13 US disclosed
CN-112626508-B Surface treatment liquid for copper or copper alloy plate and preparation method and application thereof 广州三孚新材料科技股份有限公司 2022-11-11 CN disclosed
WO-2022210960-A1 COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ORGANIZATION 日産化学株式会社 2022-10-06 WO disclosed
EP-2343597-B1 Use of an underlayer coating forming composition for lithography NISSAN CHEMICAL IND LTD (JP) 2015-08-05 EP disclosed
CN-100351309-C Underlayer coating forming composition for lithography containing compound having protected carboxyl group NISSAN CHEMICAL IND LTD (JP) 2007-11-28 CN disclosed
EP-1850180-A1 COMPOSITION FOR FORMING OF UNDERLAYER FILM FOR LITHOGRAPHY THAT CONTAINS COMPOUND HAVING PROTECTED CARBOXYL Nissan Chemical Industries, Ltd. (JP) 2007-10-31 EP disclosed
US-7226721-B2 Underlayer coating forming composition for lithography containing compound having protected carboxyl group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2007-06-05 US disclosed
US-20060234156-A1 Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2006-10-19 US disclosed
US-20060210915-A1 Composition for forming lower layer film for lithography comprising compound having protected carboxyl group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2006-09-21 US disclosed
CN-1830202-A Composition for forming lower layer film for lithography comprising compound having protected carboxyl group NISSAN CHEMICAL IND LTD (JP) 2006-09-06 CN disclosed
EP-1662769-A1 COMPOSITION FOR FORMING LOWER LAYER FILM FOR LITHOGRAPHY COMPRISING COMPOUND HAVING PROTECTED CARBOXYL GROUP Nissan Chemical Industries, Ltd. (JP) 2006-05-31 EP disclosed
EP-1617289-A1 COMPOSITION FOR FORMATION OF UNDERLAYER FILM FOR LITHOGRAPHY CONTAINING EPOXY COMPOUND AND CARBOXYLIC ACID COMPOUND Nissan Chemical Industries, Ltd. (JP) 2006-01-18 EP disclosed
EP-0522176-A1 DIHYDROPYRIDINE COMPOUNDS, AND PROCESS FOR THEIR PREPARATION FUJISAWA PHARMACEUTICAL CO., LTD. (JP) 1993-01-13 EP disclosed
WO-1992013839-A1 DIHYDROPYRIDINE COMPOUNDS, AND PROCESS FOR THEIR PREPARATION FUJISAWA PHARMACEUTICAL CO., LTD. (JP) 1992-08-20 WO disclosed