SCHEMBL2188980

SCHEMBL2188980

C(#Cc1[c]c(C#Cc2ccccc2)c(C#Cc2ccccc2)c(C#Cc2ccccc2)c1C#Cc1ccccc1)c1ccccc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.55
MAPT P10636 2/20 0.43
GRM5 P41594 7/20 0.40
CYP1A2 P05177 3/20 0.39
CYP3A4 P08684 3/20 0.39
CYP2C9 P11712 3/20 0.39
CYP2C19 P33261 3/20 0.39
NPC1 O15118 3/20 0.39
KDM4E B2RXH2 2/20 0.39
MEN1 O00255 2/20 0.39
ALDH1A1 P00352 2/20 0.39
HPGD P15428 2/20 0.39
KMT2A Q03164 2/20 0.39
SMN1; SMN2 Q16637 2/20 0.39
HSD17B10 Q99714 1/20 0.39
KCNH2 Q12809 1/20 0.38
THPO P40225 2/20 0.37
CA12 O43570 1/20 0.36
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3796509 0.83 APP (0.80) APPMAPTGRM5CYP1A2CYP3A4
SCHEMBL2187841 0.76 APP (0.52) APPMAPTGRM5CYP1A2CYP3A4
SCHEMBL2188634 0.75 APP (0.41) APPMAPTGRM5CYP1A2CYP3A4
SCHEMBL2190547 0.74 APP (0.44) APPMAPTGRM5CYP1A2CYP3A4
Diphenylacetylene SCHEMBL68254 0.74 APP (1.00) APPMAPTGRM5CYP1A2CYP3A4
Diphenylacetylene SCHEMBL960609 0.74 APP (1.00) APPMAPTGRM5CYP1A2CYP3A4
Diphenylacetylene SCHEMBL29188592 0.74 APP (1.00) APPMAPTGRM5CYP1A2CYP3A4
Diphenylacetylene SCHEMBL23754282 0.71 APP (0.92) APPMAPTGRM5CYP1A2CYP3A4
Diphenylacetylene SCHEMBL5576302 0.71 APP (0.92) APPMAPTGRM5CYP1A2CYP3A4
Diphenylacetylene SCHEMBL9273707 0.71 APP (0.92) APPMAPTGRM5CYP1A2CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8524847-B2 Organic insulating material, varnish for resin film using the same, resin film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-09-03 US disclosed
EP-2157107-B1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO (JP) 2013-05-08 EP disclosed
US-20110172351-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2011-07-14 US disclosed
EP-2157107-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2010-02-24 EP disclosed
US-20100004379-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2010-01-07 US disclosed
US-20090318610-A1 ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES SUMITOMO BAKELITE CO., LTD (JP) 2009-12-24 US disclosed
EP-2117009-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR ORGANIC INSULATING FILM USING THE SAME, ORGANIC INSULATING FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2009-11-11 EP disclosed