Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Silver. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 1/20 | 0.44 |
| ▸ | FABP3 | P05413 | 9/20 | 0.44 |
| ▸ | FFAR3 | O14843 | 2/20 | 0.39 |
| ▸ | HDAC3 | O15379 | 2/20 | 0.39 |
| ▸ | HDAC1 | Q13547 | 2/20 | 0.39 |
| ▸ | HDAC2 | Q92769 | 2/20 | 0.39 |
| ▸ | HDAC8 | Q9BY41 | 2/20 | 0.39 |
| ▸ | BBOX1 | O75936 | 2/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Silver SCHEMBL415728 | 1.00 | CA1 (0.44) | CA1FABP3FFAR3HDAC3HDAC1 | |
| Silver SCHEMBL10555198 | 1.00 | CA1 (0.44) | CA1FABP3FFAR3HDAC3HDAC1 | |
| Ammonia Solution, Strong SCHEMBL25222687 | 0.98 | CA1 (0.43) | CA1FABP3FFAR3HDAC3HDAC1 | |
| Silver SCHEMBL23174743 | 0.98 | CA1 (0.43) | CA1FABP3FFAR3HDAC3HDAC1 | |
| Silver SCHEMBL5838776 | 0.98 | CA1 (0.43) | CA1FABP3FFAR3HDAC3HDAC1 | |
| SCHEMBL887075 | 0.98 | CA1 (0.46) | CA1FABP3FFAR3HDAC3HDAC1 | |
| Silver SCHEMBL30277319 | 0.98 | CA1 (0.46) | CA1FABP3FFAR3HDAC3HDAC1 | |
| SCHEMBL1121644 | 0.98 | CA1 (0.46) | CA1FABP3FFAR3HDAC3HDAC1 | |
| SCHEMBL3930736 | 0.98 | CA1 (0.46) | CA1FABP3FFAR3HDAC3HDAC1 | |
| Methylamine SCHEMBL27233106 | 0.96 | CA1 (0.41) | CA1FABP3FFAR3HDAC3HDAC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4397150-A1 | MULTI-LAYERED COMPOSITE FOR EMI SHIELDING | Ticona LLC (US) | 2024-07-10 | — | — | EP | claimed |
| CN-117898032-A | Multilayer composite for EMI shielding | 提克纳有限责任公司 | 2024-04-16 | — | — | CN | claimed |
| US-20230078494-A1 | Multi-Layered Composite For EMI Shielding | TICONA LLC | 2023-03-16 | — | — | US | claimed |
| WO-2023034073-A1 | MULTI-LAYERED COMPOSITE FOR EMI SHIELDING | TICONA LLC (US) | 2023-03-09 | — | — | WO | claimed |
| CN-122037663-A | Silver inks comprising adhesion promoters | 贺利氏印刷电子有限公司 | 2026-05-15 | — | — | CN | disclosed |
| EP-4332267-B1 | METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE | HERAEUS ELECTRONICS GMBH & CO KG (DE) | 2025-05-14 | — | — | EP | disclosed |
| CN-112913012-B | Method for manufacturing electromagnetic interference shielding layer | 贺利氏德国有限两合公司 | 2024-07-26 | — | — | CN | disclosed |
| EP-4397150-A1 | MULTI-LAYERED COMPOSITE FOR EMI SHIELDING | Ticona LLC (US) | 2024-07-10 | — | — | EP | disclosed |
| CN-117898032-A | Multilayer composite for EMI shielding | 提克纳有限责任公司 | 2024-04-16 | — | — | CN | disclosed |
| WO-2024051999-A1 | METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND METAL-CERAMIC SUBSTRATE | HERAEUS ELECTRONICS GMBH & CO. KG (DE) | 2024-03-14 | — | — | WO | disclosed |
| EP-4332267-A1 | METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE AND METAL-CERAMIC SUBSTRATE | Heraeus Electronics GmbH & Co. KG (DE) | 2024-03-06 | — | — | EP | disclosed |
| US-11848276-B2 | Method of manufacturing an electromagnetic interference shielding layer | HERAEUS ELECTRONICS GMBH & CO. KG (DE) | 2023-12-19 | — | — | US | disclosed |
| WO-2023034073-A1 | MULTI-LAYERED COMPOSITE FOR EMI SHIELDING | TICONA LLC (US) | 2023-03-09 | — | — | WO | disclosed |
| US-20210358861-A1 | METHOD OF MANUFACTURING AN ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER | Heraeus Deutschland GmbH & Co. KG (DE) | 2021-11-18 | — | — | US | disclosed |
| EP-3878009-A1 | METHOD OF MANUFACTURING AN ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER | Heraeus Deutschland GmbH & Co KG (DE) | 2021-09-15 | — | — | EP | disclosed |
| CN-112913012-A | Method for manufacturing electromagnetic interference shielding layer | 贺利氏德国有限两合公司 | 2021-06-04 | — | — | CN | disclosed |
| CN-112822931-A | Electromagnetic interference shielding in a recess of an electronic module | 贺利氏德国有限两合公司 | 2021-05-18 | — | — | CN | disclosed |
| US-20210136963-A1 | ELECTROMAGNETIC INTERFERENCE SHIELDING IN RECESSES OF ELECTRONIC MODULES | Heraeus Deutschland GmbH & Co. KG (DE) | 2021-05-06 | — | — | US | disclosed |
| EP-3817043-A1 | ELECTROMAGNETIC INTERFERENCE SHIELDING IN RECESSES OF ELECTRONIC MODULES | Heraeus Deutschland GmbH & Co KG (DE) | 2021-05-05 | — | — | EP | disclosed |
| EP-3648161-A1 | METHOD OF MANUFACTURING AN ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER | Heraeus Deutschland GmbH & Co KG (DE) | 2020-05-06 | — | — | EP | disclosed |