⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9785031 | 0.89 | — | — | |
| SCHEMBL4441893 | 0.82 | — | — | |
| SCHEMBL2188746 | 0.75 | — | — | |
| SCHEMBL2001702 | 0.69 | — | — | |
| SCHEMBL11405480 | 0.65 | PKM (0.44) | — | |
| SCHEMBL8941008 | 0.65 | PKM (0.44) | — | |
| SCHEMBL22660504 | 0.65 | — | — | |
| SCHEMBL4037236 | 0.63 | PKM (0.31) | — | |
| SCHEMBL11091629 | 0.63 | PKM (0.36) | — | |
| SCHEMBL4036681 | 0.61 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8524847-B2 | Organic insulating material, varnish for resin film using the same, resin film and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-09-03 | — | — | US | disclosed |
| EP-2157107-B1 | ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO (JP) | 2013-05-08 | — | — | EP | disclosed |
| US-8178631-B2 | Resin composition, varnish, resin film and semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2012-05-15 | — | — | US | disclosed |
| EP-2000510-B1 | RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM | SUMITOMO BAKELITE CO (JP) | 2012-05-02 | — | — | EP | disclosed |
| US-20110172351-A1 | ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2011-07-14 | — | — | US | disclosed |
| US-7863347-B2 | Resin composition, varnish, resin film and semiconductor device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-01-04 | — | — | US | disclosed |
| EP-2157107-A1 | ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Co., Ltd. (JP) | 2010-02-24 | — | — | EP | disclosed |
| US-20100004379-A1 | ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-01-07 | — | — | US | disclosed |
| US-20090318610-A1 | ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES | SUMITOMO BAKELITE CO., LTD (JP) | 2009-12-24 | — | — | US | disclosed |
| EP-2117009-A1 | ORGANIC INSULATING MATERIAL, VARNISH FOR ORGANIC INSULATING FILM USING THE SAME, ORGANIC INSULATING FILM AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Co., Ltd. (JP) | 2009-11-11 | — | — | EP | disclosed |
| US-7612155-B2 | Film forming composition, insulating film formed by use of the composition, and electronic device | FUJIFILM CORPORATION (JP) | 2009-11-03 | — | — | US | disclosed |
| US-20090214860-A1 | Resin Composition, Varnish, Resin Film and Semiconductor Device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2009-08-27 | — | — | US | disclosed |
| US-20090118431-A1 | RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE COMPANY, LTD (JP) | 2009-05-07 | — | — | US | disclosed |
| EP-2000510-A1 | RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM | Sumitomo Bakelite Company, Ltd. (JP) | 2008-12-10 | — | — | EP | disclosed |
| EP-1953181-A1 | RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Ltd. (JP) | 2008-08-06 | — | — | EP | disclosed |
| US-20070255003-A1 | Film forming composition, insulating film formed by use of the composition, and electronic device | FUJIFILM CORPORATION (JP) | 2007-11-01 | — | — | US | disclosed |