SCHEMBL2190753

SCHEMBL2190753

C(#Cc1c[c]cc(C#Cc2ccccc2)c1C#Cc1ccccc1)c1ccccc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.52
CYP1A2 P05177 4/20 0.47
CYP3A4 P08684 4/20 0.47
CYP2C9 P11712 4/20 0.47
CYP2C19 P33261 4/20 0.47
MAPT P10636 3/20 0.47
NPC1 O15118 3/20 0.47
MEN1 O00255 3/20 0.47
ALDH1A1 P00352 3/20 0.47
HPGD P15428 3/20 0.47
KMT2A Q03164 3/20 0.47
HSD17B10 Q99714 2/20 0.47
KDM4E B2RXH2 2/20 0.47
SMN1; SMN2 Q16637 2/20 0.47
CA12 O43570 2/20 0.40
CA2 P00918 2/20 0.40
CA9 Q16790 2/20 0.40
RAB9A P51151 2/20 0.40
GRM5 P41594 3/20 0.39
TSHR P16473 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3797526 0.79 APP (0.60) APPCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL3786925 0.77 APP (0.57) APPCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL2187896 0.77 APP (0.50) APPCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL3792911 0.77 APP (0.63) APPCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL21858064 0.76 APP (0.44) APPCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL2190547 0.76 APP (0.44) APPCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL3796509 0.75 APP (0.80) APPCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL2189486 0.75 APP (0.60) APPCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL5871989 0.73 APP (0.75) APPCYP1A2CYP3A4CYP2C9CYP2C19
SCHEMBL2114742 0.73 APP (0.75) APPCYP1A2CYP3A4CYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8524847-B2 Organic insulating material, varnish for resin film using the same, resin film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-09-03 US disclosed
EP-2157107-B1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO (JP) 2013-05-08 EP disclosed
US-20110172351-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2011-07-14 US disclosed
EP-2157107-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2010-02-24 EP disclosed
US-20100004379-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2010-01-07 US disclosed
US-20090318610-A1 ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES SUMITOMO BAKELITE CO., LTD (JP) 2009-12-24 US disclosed
EP-2117009-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR ORGANIC INSULATING FILM USING THE SAME, ORGANIC INSULATING FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2009-11-11 EP disclosed