SCHEMBL2195083

SCHEMBL2195083

C=C(C)C(=O)OCCNC(=O)NCCOC(=O)C(=C)C

nearest known ligand 0.52

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.52
TSHR P16473 3/20 0.50
ALDH1A1 P00352 2/20 0.44
POLB P06746 1/20 0.38
APEX1 P27695 1/20 0.38
HTT P42858 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
EPHX1 P07099 5/20 0.34
MEN1 O00255 2/20 0.34
KMT2A Q03164 2/20 0.34
CYP1A2 P05177 1/20 0.34
CYP3A4 P08684 1/20 0.34
EPHX2 P34913 2/20 0.33
GAA P10253 1/20 0.32
ACHE P22303 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13590585 0.94 THRB (0.47) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL14582190 0.94 TSHR (0.50) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL10093567 0.94 THRB (0.47) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL4087586 0.93 THRB (0.50) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL12511119 0.93 TSHR (0.53) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL3250861 0.93 TSHR (0.53) THRBTSHRALDH1A1EPHX1MEN1
SCHEMBL13589407 0.93 TSHR (0.53) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL8424339 0.93 THRB (0.46) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL13589405 0.93 TSHR (0.53) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL11837742 0.93 THRB (0.46) THRBTSHRALDH1A1POLBAPEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 94 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
EP-4660704-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250355350-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
EP-4650874-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-19 EP disclosed
EP-4636011-A1 POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-10-22 EP disclosed
EP-4636485-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-10-22 EP disclosed
US-11892773-B2 Photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-02-06 US disclosed
US-11891472-B2 Composition, production method for composition, and production method for unsaturated compound RESONAC CORPORATION (JP) 2024-02-06 US disclosed
EP-3398983-B1 POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS SHINETSU CHEMICAL CO (JP) 2023-09-27 EP disclosed
US-20220119585-A1 COMPOSITION, PRODUCTION METHOD FOR COMPOSITION, AND PRODUCTION METHOD FOR UNSATURATED COMPOUND SHOWA DENKO K.K. (JP) 2022-04-21 US disclosed
US-20050244739-A1 Highly heat-resistant, negative-type photosensitive resin composition ASAHI KASEI EMD CORPORATION (JP) 2005-11-03 US disclosed
EP-1536286-A1 HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Asahi Kasei EMD Corporation (JP) 2005-06-01 EP disclosed
US-6171735-B1 FORMED BY EXPOSING TO RADIATION NEGATIVE-ACTING PRINTING PLATE COMPRISING SUBSTRATE HAVING COATED THEREON PHOTOSENSITIVE COMPOSITION COMPRISING REACTIVE ACID FUNCTIONAL POLYMER, PHOTOINITIATOR, APPLYING FOUNTAIN SOLUTION TO LATENT ARTICLE 3M INNOVATIVE PROPERTIES COMPANY 2001-01-09 US disclosed
US-6027857-A PHOTOCURABLE COMPOSITION COMPRISING ANIONIC ACRYLIC POLYMER CONTAINING ALLYL ISOCYANATE OR 2-ISOCYANATOETHYLMETHACRYLATE GROUPS AND A PHOTOINITIATOR MINNESOTA MINING AND MANUFACTURING COMPANY (US) 2000-02-22 US disclosed
EP-0823070-B1 NEGATIVE-ACTING NO-PROCESS PRINTING PLATES MINNESOTA MINING & MFG (US) 1999-12-29 EP disclosed
US-5925497-A COATING MADE BY REACTING ISOCYANATE GROUPS FROM ETHYLENICALLY UNSATURATED PHOTOCURABLE GROUPS WITH A CARBOXY GROUP OF A POLYALKENOIC ACID CURABLE UPON EXPOSURE TO RADIATION; NO PROCESSING REQUIRED PRIOR TO BEING RUN ON A PRESS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1999-07-20 US disclosed
US-5910395-A COATING PHOTOSENSITIVE COMPOSITION ON SUBSTRATE, PHOTOCURING WITH RADIATION; PLATES DO NOT REQUIRE PROCESSING PRIOR TO BEING RUN ON PRESS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1999-06-08 US disclosed
US-5849462-A Negative-acting no-process printing plates MINNESOTA MINING & MANUFACTURING COMPANY (US) 1998-12-15 US disclosed
EP-0823070-A1 NEGATIVE-ACTING NO-PROCESS PRINTING PLATES MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1998-02-11 EP disclosed
WO-1996034316-A1 NEGATIVE-ACTING NO-PROCESS PRINTING PLATES MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1996-10-31 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR THRB 3424/4885TSHR 3214/4885ALDH1A1 3706/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.