SCHEMBL21969929

SCHEMBL21969929

CNC(=O)c1cccc(C(=O)NCc2ccc(CNC(=O)c3cccc(C(N)=O)c3)cc2)c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HDAC6 Q9UBN7 3/20 0.56
▸ HDAC8 Q9BY41 2/20 0.56
▸ HDAC2 Q92769 1/20 0.56
▸ EPHX2 P34913 3/20 0.55
▸ NR1H4 Q96RI1 3/20 0.55
▸ CA1 P00915 2/20 0.53
▸ CA2 P00918 2/20 0.53
▸ HDAC1 Q13547 1/20 0.52
▸ MMP13 P45452 3/20 0.52
▸ KMT2A Q03164 2/20 0.51
▸ HTT P42858 1/20 0.51
▸ TSHR P16473 1/20 0.51
▸ ALDH1A1 P00352 1/20 0.50
▸ GAA P10253 1/20 0.50
▸ HSD17B10 Q99714 1/20 0.50
▸ SIRT2 Q8IXJ6 1/20 0.50
▸ KLKB1 P03952 1/20 0.50
▸ CFD P00746 1/20 0.50
▸ MEN1 O00255 1/20 0.50
▸ LMNA P02545 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25888179 0.92 HDAC6 (0.64) HDAC6HDAC8HDAC2EPHX2NR1H4
SCHEMBL20015583 0.92 HDAC6 (0.64) HDAC6HDAC8HDAC2EPHX2NR1H4
SCHEMBL24025161 0.88 HDAC2 (0.56) HDAC6HDAC8HDAC2EPHX2NR1H4
SCHEMBL29332482 0.88 TSHR (0.64) HDAC6HDAC8HDAC2EPHX2NR1H4
SCHEMBL23080259 0.88 HDAC6 (0.56) HDAC6HDAC8HDAC2EPHX2NR1H4
SCHEMBL29332849 0.87 TSHR (0.58) HDAC6HDAC8HDAC2EPHX2NR1H4
SCHEMBL39965 0.86 HDAC8 (0.69) HDAC6HDAC8KMT2ATSHRGAA
SCHEMBL29350858 0.86 HDAC8 (0.69) HDAC6HDAC8KMT2ATSHRGAA
SCHEMBL28352398 0.82 RORC (0.61) CA1CA2TSHRALDH1A1GAA
SCHEMBL25602690 0.82 HDAC6 (0.50) HDAC6HDAC8HDAC2EPHX2NR1H4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11681217-B2 Photosensitive resin composition, photosensitive resin layer using the same and color filter SAMSUNG SDI CO., LTD. (KR) 2023-06-20 — — US disclosed
US-20200142301-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME AND COLOR FILTER SAMSUNG SDI CO., LTD. (KR) 2020-05-07 — — US disclosed
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