⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ammonia Solution, Strong SCHEMBL561792 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL2961368 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL12984477 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL2995399 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL5535903 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL11509216 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL17159788 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL9618334 | 1.00 | — | — | |
| Methane SCHEMBL25292117 | 0.82 | — | — | |
| Fluoride SCHEMBL2982750 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 554 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11984158-B2 | Non-volatile static random access memory incorporating resistive random-access memory | POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION (TW) | 2024-05-14 | — | — | US | claimed |
| CN-117888017-A | Titanium nitride iron material and preparation method thereof | 北京科技大学 | 2024-04-16 | — | — | CN | claimed |
| CN-116859504-A | Composite structure optical fiber based on titanium nitride/titanium carbide heterojunction and preparation method thereof | 深圳大学 | 2023-10-10 | — | — | CN | claimed |
| CN-116631471-A | Nonvolatile static random access memory | 力晶积成电子制造股份有限公司 | 2023-08-22 | — | — | CN | claimed |
| US-20230253037-A1 | NON-VOLATILE STATIC RANDOM ACCESS MEMORY | POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION (TW) | 2023-08-10 | — | — | US | claimed |
| CN-114824064-A | Metal layer etching method applied to three-axis magnetic sensor | 上海华虹宏力半导体制造有限公司 | 2022-07-29 | — | — | CN | claimed |
| US-10699913-B2 | Manufacturing method for trench | UNITED MICROELECTRONICS CORPORATION (TW) | 2020-06-30 | — | — | US | claimed |
| US-20190131142-A1 | MANUFACTURING METHOD FOR TRENCH | UNITED MICROELECTRONICS CORPORATION (TW) | 2019-05-02 | — | — | US | claimed |
| US-10199232-B2 | Conductor line structure | UNITED MICROELECTRONICS CORPORATION (TW) | 2019-02-05 | — | — | US | claimed |
| CN-108807277-A | Grid is around semiconductor devices and preparation method thereof | 三星电子株式会社 | 2018-11-13 | — | — | CN | claimed |
| US-6475911-B1 | Method of forming noble metal pattern | MICRON TECHNOLOGY, INC. | 2002-11-05 | — | — | US | claimed |
| US-20020155660-A1 | Method for producing a microelectronic structure | INFINEON TECHNOLOGIES AG (DE) | 2002-10-24 | — | — | US | claimed |
| US-20020142581-A1 | Assembly including semiconductor chip, conductive pad, conductive trace, connection joint, and insulative adhesive; conductive trace includes routing line and pillar; connection joint contacts and electrically connects routing line and pad | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2002-10-03 | — | — | US | claimed |
| US-6436814-B1 | Interconnection structure and method for fabricating same | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2002-08-20 | — | — | US | claimed |
| CN-1343370-A | Method for manufacturing microelectronic structure | INFINEON TECHNOLOGIES AG (DE) | 2002-04-03 | — | — | CN | claimed |
| US-6017662-A | Method of reducing laser mark peeling | UNITED MICROELECTRONICS CORP. (TW) | 2000-01-25 | — | — | US | claimed |
| US-5789318-A | REACTION TO FORM TITANIUM SILICIDE | VARIAN ASSOCIATES, INC. (US) | 1998-08-04 | — | — | US | claimed |
| US-5714251-A | Magneto-optic memory device | SHARP KABUSHIKI KAISHA (JP) | 1998-02-03 | — | — | US | claimed |
| WO-1997031390-A1 | USE OF TITANIUM HYDRIDE IN INTEGRATED CIRCUIT FABRICATION | VARIAN ASSOCIATES, INC. (US) | 1997-08-28 | — | — | WO | claimed |
| US-5449639-A | Disposable metal anti-reflection coating process used together with metal dry/wet etch | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 1995-09-12 | — | — | US | claimed |