SCHEMBL220388

SCHEMBL220388

CC(=O)C(C)=C=N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6289093 0.76
SCHEMBL7860012 0.69
Butanedione SCHEMBL28132378 0.69 TSHR (0.58)
SCHEMBL7860015 0.69
Acetone SCHEMBL23501541 0.65
Acetone SCHEMBL9738904 0.65 LMNA (0.55)
Acetone SCHEMBL27898062 0.65 LMNA (0.55)
SCHEMBL11956672 0.64
SCHEMBL1323234 0.62
Butanedione SCHEMBL3273053 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9039941-B2 Conductive paste for screen printing DIC CORPORATION (JP) 2015-05-26 US claimed
EP-2305402-B1 METHOD FOR PRODUCING SILVER-CONTAINING POWDER AND CONDUCTIVE PASTE USING THE SAME DAINIPPON INK & CHEMICALS (JP) 2017-11-29 EP disclosed
CN-105164183-B Metal nanoparticle protects polymer and colloidal metal solution and their manufacture method DIC株式会社 2017-06-30 CN disclosed
CN-104603227-B Polishing composition and method for producing substrate 福吉米株式会社 2017-03-08 CN disclosed
US-9390830-B2 Conductive paste for screen printing DIC CORPORATION (JP) 2016-07-12 US disclosed
US-9039941-B2 Conductive paste for screen printing DIC CORPORATION (JP) 2015-05-26 US disclosed
US-20130056687-A1 CONDUCTIVE PASTE FOR SCREEN PRINTING DIC CORPORATION (JP) 2013-03-07 US disclosed
US-20130048920-A1 CONDUCTIVE PASTE FOR SCREEN PRINTING DIC CORPORATION (JP) 2013-02-28 US disclosed
US-8088437-B2 Method for production of silver-containing nano-structure, and silver-containing nano-structure DIC CORPORATION (JP) 2012-01-03 US disclosed
US-20110180764-A1 SILVER-CONTAINING POWDER, METHOD FOR PRODUCING THE SAME, CONDUCTIVE PASTE USING THE SAME, AND PLASTIC SUBSTRATE DIC CORPORATION (JP) 2011-07-28 US disclosed
EP-2305402-A1 SILVER-CONTAINING POWDER, METHOD FOR PRODUCING THE SAME, CONDUCTIVE PASTE USING THE SAME, AND PLASTIC SUBSTRATE DIC Corporation (JP) 2011-04-06 EP disclosed
US-20100120960-A1 METHOD FOR PRODUCTION OF SILVER-CONTAINING NANO-STRUCTURE, AND SILVER-CONTAINING NANO-STRUCTURE DIC CORPORATION (JP) 2010-05-13 US disclosed
EP-2147733-A1 METHOD FOR PRODUCTION OF SILVER-CONTAINING NANO-STRUCTURE, AND SILVER-CONTAINING NANO-STRUCTURE DIC Corporation (JP) 2010-01-27 EP disclosed