SCHEMBL22043709

SCHEMBL22043709

CC1(C)C2CC3OC(=O)C(C2)C31

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14415261 0.69 — —
SCHEMBL18799419 0.69 — —
SCHEMBL438919 0.69 — —
SCHEMBL14028633 0.69 — —
SCHEMBL13586951 0.64 MAPT (0.32) —
SCHEMBL12934464 0.64 MAPT (0.32) —
SCHEMBL10691677 0.64 — —
SCHEMBL2379574 0.64 — —
SCHEMBL21567764 0.62 — —
SCHEMBL21910750 0.62 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11829068-B2 Resist composition, method of forming resist pattern, compound, and resin TOKYO OHKA KOGYO CO., LTD. (JP) 2023-11-28 — — US disclosed
US-11586111-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-02-21 — — US disclosed
US-20220121117-A1 RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND, AND RESIN TOKYO OHKA KOGYO CO., LTD. (JP) 2022-04-21 — — US disclosed
US-20200174369-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-04 — — US disclosed
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