M-Xylene

M-Xylene

SCHEMBL2207503

CCCCCCC(O)CCCCCCCCCCC(N)=O.Cc1cccc(C)c1

nearest known ligand 0.57

Full drug profile on Sugi Atlas →

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
▸ FFAR4 Q5NUL3 1/20 0.51
▸ FFAR1 O14842 1/20 0.51
▸ PTGER1 P34995 1/20 0.46
▸ PTGER4 P35408 1/20 0.46
▸ PTGER3 P43115 1/20 0.46
▸ GPR84 Q9NQS5 2/20 0.45
▸ EPHX2 P34913 1/20 0.44
▸ ICMT O60725 1/20 0.44
▸ FAAH O00519 2/20 0.43
▸ NFKB1 P19838 1/20 0.43
▸ TRPV1 Q8NER1 1/20 0.42
▸ KDM4E B2RXH2 2/20 0.42
▸ SOAT1 P35610 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Octadecanoic Acid Amide SCHEMBL6269185 0.89 ICMT (0.50) ICMTFAAHKDM4ESOAT1
Octadecanoic Acid Amide SCHEMBL4444265 0.89 ICMT (0.50) ICMTFAAHKDM4ESOAT1
SCHEMBL2207501 0.83 HDAC1 (0.38) FFAR4FFAR1PTGER1EPHX2
Isophthalic Acid SCHEMBL27657012 0.83 FFAR4 (0.53) FFAR4FFAR1PTGER1PTGER4PTGER3
SCHEMBL19475125 0.83 FFAR4 (0.71) FFAR4FFAR1GPR84FAAHNFKB1
M-Xylene SCHEMBL9618374 0.83 PARP1 (0.53) ICMT
Octadecanoic Acid Amide SCHEMBL5617445 0.83 FFAR4 (0.71) FFAR4FFAR1GPR84FAAHNFKB1
SCHEMBL19475126 0.83 FFAR4 (0.71) FFAR4FFAR1GPR84FAAHNFKB1
SCHEMBL21585875 0.83 FFAR4 (0.71) FFAR4FFAR1GPR84FAAHNFKB1
SCHEMBL19066822 0.83 FFAR4 (0.71) FFAR4FFAR1GPR84FAAHNFKB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117098833-A Grease composition 出光兴产株式会社 2023-11-21 — — CN disclosed
US-9938406-B2 Polylactic acid resin sheet for thermal molding use KAO CORPORATION (JP) 2018-04-10 — — US disclosed
EP-2851388-B1 POLYLACTIC ACID RESIN SHEET FOR THERMAL MOLDING USE KAO CORP (JP) 2016-09-21 — — EP disclosed
US-20150086768-A1 POLYLACTIC ACID RESIN SHEET FOR THERMAL MOLDING USE KAO CORPORATION (JP) 2015-03-26 — — US disclosed
EP-2851388-A1 POLYLACTIC ACID RESIN SHEET FOR THERMAL MOLDING USE Kao Corporation (JP) 2015-03-25 — — EP disclosed
EP-2674459-A1 POLYLACTIC ACID RESIN COMPOSITION Kao Corporation (JP) 2013-12-18 — — EP disclosed
US-20130287903-A1 POLYLACTIC ACID RESIN COMPOSITION KAO CORPORATION (JP) 2013-10-31 — — US disclosed
US-8481620-B2 Process for producing resin composition KAO CORPORATION (JP) 2013-07-09 — — US disclosed
EP-2345688-B1 PROCESS FOR PRODUCING RESIN COMPOSITION KAO CORP (JP) 2013-03-27 — — EP disclosed
US-20110196076-A1 PROCESS FOR PRODUCING RESIN COMPOSITION KAO CORPORATION (JP) 2011-08-11 — — US disclosed
EP-2345688-A1 PROCESS FOR PRODUCING RESIN COMPOSITION Kao Corporation (JP) 2011-07-20 — — EP disclosed
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