⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8590450 | 0.78 | — | — | |
| SCHEMBL29111188 | 0.76 | — | — | |
| SCHEMBL3811725 | 0.76 | — | — | |
| SCHEMBL3419249 | 0.67 | — | — | |
| SCHEMBL861552 | 0.64 | — | — | |
| SCHEMBL10479346 | 0.63 | — | — | |
| SCHEMBL3833244 | 0.63 | — | — | |
| SCHEMBL10950458 | 0.62 | — | — | |
| SCHEMBL10832319 | 0.62 | — | — | |
| SCHEMBL29510 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2823084-B1 | METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS | ATOTECH DEUTSCHLAND GMBH (DE) | 2015-08-19 | — | — | EP | claimed |
| US-20150050422-A1 | METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS | ATOTECH USA, LLC | 2015-02-19 | — | — | US | claimed |
| EP-2823084-A1 | METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS | ATOTECH Deutschland GmbH (DE) | 2015-01-14 | — | — | EP | claimed |
| WO-2013143961-A1 | METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS | ATOTECH DEUTSCHLAND GMBH (DE) | 2013-10-03 | — | — | WO | claimed |
| EP-2644744-A1 | Method for promoting adhesion between dielectric substrates and metal layers | Atotech Deutschland GmbH (DE) | 2013-10-02 | — | — | EP | claimed |
| CN-107112311-B | Method for electromagnetic shielding and thermal management of active components | 德国艾托特克公司 | 2020-10-02 | — | — | CN | disclosed |
| EP-2178828-B1 | ALDIMINES AND COMPOUNDS CONTAINING ALDIMINE | SIKA TECH AG (CH) | 2019-06-26 | — | — | EP | disclosed |
| EP-2132248-B1 | ALDIMINES WITH REACTIVE GROUPS COMPRISING ACTIVE HYDROGEN | SIKA TECHNOLOGY AG (CH) | 2016-07-13 | — | — | EP | disclosed |
| US-8519038-B2 | Aldimines and compositions comprising aldimine | SIKA TECHNOLOGY AG (CH) | 2013-08-27 | — | — | US | disclosed |
| US-20120220736-A1 | ALDIMINES AND COMPOSITIONS COMPRISING ALDIMINE | SIKA TECHNOLOGY AG (CH) | 2012-08-30 | — | — | US | disclosed |
| US-8252859-B2 | Aldimines and compositions comprising aldimine | SIKA TECHNOLOGY AG (CH) | 2012-08-28 | — | — | US | disclosed |
| EP-2031031-B1 | Use of a latent acid for improving adhesion | SIKA TECHNOLOGY AG (CH) | 2011-07-13 | — | — | EP | disclosed |
| EP-1975190-A1 | Aldimines with reactive groups containing active hydrogen | Sika Technology AG (CH) | 2008-10-01 | — | — | EP | disclosed |
| US-20080138522-A1 | Aldiminoalkylsilanes | SIKA TECHNOLOGY AG (CH) | 2008-06-12 | — | — | US | disclosed |
| EP-1697385-A2 | ALDIMINOALKYLSILANES | Sika Technology AG (CH) | 2006-09-06 | — | — | EP | disclosed |
| WO-2005058921-A2 | ALDIMINOALKYLSILANES | SIKA TECHNOLOGY AG (CH) | 2005-06-30 | — | — | WO | disclosed |
| EP-1544204-A1 | Aldiminoalkylsilanes | Sika Technology AG (CH) | 2005-06-22 | — | — | EP | disclosed |
| US-6136926-A | CURING WITH ETHYLENICALLY UNSATURATED ORGANOSILANE COMPOUND; HEATING BELOW SOFTENING POINT | BOREALIS GMBH (AT) | 2000-10-24 | — | — | US | disclosed |
| EP-0821018-A2 | Crosslinkable olefinic polymers and method for their preparation | PCD-Polymere Gesellschaft m.b.H. (AT) | 1998-01-28 | — | — | EP | disclosed |
| US-4551485-A | REINFORCING FILLERS, NUCLEATION PROMOTER, CRYSTALLIZATION PROMOTER | ETHYL CORPORATION (US) | 1985-11-05 | — | — | US | disclosed |