SCHEMBL221143

SCHEMBL221143

CCCOS(=O)(=O)S

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11657633 0.97
SCHEMBL3867137 0.97
SCHEMBL8995515 0.83
SCHEMBL5856221 0.81 CA1 (0.60)
SCHEMBL5078169 0.81 CA1 (0.33)
SCHEMBL21066506 0.79 CA1 (0.61)
SCHEMBL21066499 0.79 CA1 (0.61)
SCHEMBL21066502 0.79 CA1 (0.61)
SCHEMBL21066497 0.79 CA1 (0.61)
SCHEMBL6691472 0.79 CA1 (0.61)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 110 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115626671-B Multifunctional double-ligand platinum nano particle and preparation method and application thereof 华南理工大学 2024-07-02 CN claimed
CN-113956479-A Copper electroplating accelerator and synthesis method and application thereof 电子科技大学 2022-01-21 CN claimed
EP-2385881-B1 PROCESS FOR IMPROVING THE ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES MACDERMID ACUMEN INC (US) 2019-09-04 EP claimed
CN-110093637-A For flexibility coat copper plate, the electrolytic copper foil of flexible printed-circuit board and preparation method 九江德福科技股份有限公司 2019-08-06 CN claimed
CN-104934363-B The production method for forming the method and interconnection layer of metal structure in the semiconductor device 中芯国际集成电路制造(上海)有限公司 2018-09-18 CN claimed
CN-104934363-A Method for forming metal structure in semiconductor device, and manufacturing method for interconnection layer SEMICONDUCTOR MFG INT SHANGHAI 2015-09-23 CN claimed
CN-103014685-B Double-tank method for continuously plating thick gold with cyanide-free chemical gold plating solutions UNIV XIAMEN 2015-07-01 CN claimed
EP-1311820-B1 INCREASED SEPARATION EFFICIENCY VIA CONTROLLED AGGREGATION OF MAGNETIC NANOPARTICLES JANSSEN DIAGNOSTICS LLC (US) 2015-02-11 EP claimed
CN-103014685-A Double-tank method for continuously plating thick gold with cyanide-free chemical gold plating solutions UNIV XIAMEN 2013-04-03 CN claimed
US-8088246-B2 Process for improving the adhesion of polymeric materials to metal surfaces CITIBANK, N.A. 2012-01-03 US claimed
CN-1181530-C Electroplated interconnection structures on integrated circuit chips 国际商业机器公司 2004-12-22 CN claimed
EP-1311820-A4 INCREASED SEPARATION EFFICIENCY VIA CONTROLLED AGGREGATION OF MAGNETIC NANOPARTICLES IMMUNIVEST CORP (US) 2004-06-23 EP claimed
US-20030203507-A1 Increased separation efficiency via controlled aggregation of magnetic nanoparticles VERIDEX, LLC 2003-10-30 US claimed
US-6623982-B1 Analyzing biological cells, bacteria, viruses, hormones, proteins, peptides, hemagglutinins, nucleotides or drugs by removing interferences due to ferromagnetic colloids; clarity IMMUNIVEST CORPORATION 2003-09-23 US claimed
US-6620627-B1 Kit, for isolating tumor cells, comprising a reagent to inactivate endogenous aggregating factors, antibody coupled to base coating material IMMUNIVEST CORPORATION 2003-09-16 US claimed
EP-1311820-A1 INCREASED SEPARATION EFFICIENCY VIA CONTROLLED AGGREGATION OF MAGNETIC NANOPARTICLES Immunivest Corporation (US) 2003-05-21 EP claimed
WO-2002006790-A1 INCREASED SEPARATION EFFICIENCY VIA CONTROLLED AGGREGATION OF MAGNETIC NANOPARTICLES IMMUNIVEST CORPORATION (US) 2002-01-24 WO claimed
CN-1242107-A Electroplated interconnection structures on integrated circuit chips IBM (US) 2000-01-19 CN claimed
EP-0396610-A1 ELECTROCHEMICAL PROCESSES JCT CONTROLS LIMITED (GB) 1990-11-14 EP claimed
WO-1989007162-A1 ELECTROCHEMICAL PROCESSES JCT CONTROLS LIMITED (GB) 1989-08-10 WO claimed