SCHEMBL3867137

SCHEMBL3867137

CCCOS(=O)(=O)S.[NaH]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL221143 0.97
SCHEMBL11657633 0.94
SCHEMBL10752813 0.82 CA1 (0.32)
SCHEMBL8995515 0.81
SCHEMBL6687364 0.80 CA1 (0.59)
SCHEMBL5856221 0.79 CA1 (0.60)
SCHEMBL5078169 0.78 CA1 (0.33)
SCHEMBL21066504 0.77 CA1 (0.61)
SCHEMBL21066499 0.77 CA1 (0.61)
SCHEMBL21066502 0.77 CA1 (0.61)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107313085-B The copper electroplating filling method of fine blind hole in a kind of high density circuit board 中国科学院金属研究所 2019-10-22 CN claimed
CN-107313085-A The copper plating fill method of fine blind hole in a kind of high density circuit board 中国科学院金属研究所 2017-11-03 CN claimed
CN-106047026-A Metallic copper anticorrosion nano coating and preparation method thereof 合肥和安机械制造有限公司 2016-10-26 CN claimed
CN-104380469-A Methods of nanowire functionalization, dispersion, alignment and attachment SOL VOLTAICS AB 2015-02-25 CN claimed
US-7588675-B2 Iron-phosphorus electroplating bath and method ATOTECH DEUTSCHLAND GMBH (DE) 2009-09-15 US claimed
US-20090101515-A1 IRON-PHOSPHORUS ELECTROPLATING BATH AND METHOD ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) 2009-04-23 US claimed
CN-107313085-B The copper electroplating filling method of fine blind hole in a kind of high density circuit board 中国科学院金属研究所 2019-10-22 CN disclosed
CN-108760821-A A kind of qualitative and quantitative analysis method of electroplating additive 电子科技大学 2018-11-06 CN disclosed
CN-107313085-A The copper plating fill method of fine blind hole in a kind of high density circuit board 中国科学院金属研究所 2017-11-03 CN disclosed
CN-106047026-A Metallic copper anticorrosion nano coating and preparation method thereof 合肥和安机械制造有限公司 2016-10-26 CN disclosed
CN-102759586-A Method for measuring content of sulfhydryl compound in composition by high performance liquid chromatography SHANGHAI MODERN PHARMACEUTICAL ENGINEERING RES CT CO LTD 2012-10-31 CN disclosed
CN-102327233-A Dimercaptosuccinic acid granular formulation HAINAN HONZ PHARMACEUTICAL CO LTD 2012-01-25 CN disclosed
US-7588675-B2 Iron-phosphorus electroplating bath and method ATOTECH DEUTSCHLAND GMBH (DE) 2009-09-15 US disclosed
US-20090101515-A1 IRON-PHOSPHORUS ELECTROPLATING BATH AND METHOD ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) 2009-04-23 US disclosed
US-7494578-B2 Iron-phosphorus electroplating bath and method ATOTECH DEUTSCHLAND GMBH (DE) 2009-02-24 US disclosed
CN-1318095-C Tracer agent for oxygen lacking tumor cell and its usage SHANGHAI CHEST HOSPITAL (CN) 2007-05-30 CN disclosed
EP-1721029-A2 IRON-PHOSPHORUS ELECTROPLATING BATH AND METHOD ATOTECH DEUTSCHLAND GMBH (DE) 2006-11-15 EP disclosed
WO-2005093134-A2 IRON-PHOSPHORUS ELECTROPLATING BATH AND METHOD ATOTECH DEUTSCHLAND GMBH (DE) 2005-10-06 WO disclosed
US-20050189232-A1 Iron-phosphorus electroplating bath and method ATOTECH USA, LLC 2005-09-01 US disclosed
CN-1544093-A Tracer agent for oxygen lacking tumor cell and its usage 上海市胸科医院 2004-11-10 CN disclosed