SCHEMBL221290

SCHEMBL221290

[CH2]OC(=O)C=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28105125 0.82 TSHR (0.38)
SCHEMBL278164 0.74
SCHEMBL419299 0.74 TSHR (0.46)
SCHEMBL6342075 0.73
SCHEMBL83524 0.71
SCHEMBL5334628 0.71
SCHEMBL5071464 0.71 TSHR (0.43)
SCHEMBL7076062 0.71 TSHR (0.43)
SCHEMBL31635272 0.71 TSHR (0.43)
SCHEMBL5029222 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1936 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118234766-A Polymer compound and use thereof 株式会社三养社 2024-06-21 CN claimed
WO-2024070902-A1 COMPOUND, METHOD FOR PRODUCING SAID COMPOUND, CURABLE MATERIAL, CURABLE COMPOSITION, METHOD FOR PRODUCING CURED ARTICLE, AND CURED ARTICLE 株式会社ADEKA 2024-04-04 WO claimed
CN-117616068-A Organopolysiloxane and method for producing same 信越化学工业株式会社 2024-02-27 CN claimed
CN-117321141-A Solvent-free composition 日产化学株式会社 2023-12-29 CN claimed
CN-117279979-A Triazine ring-containing polymer and film-forming composition containing same 日产化学株式会社 2023-12-22 CN claimed
CN-117279980-A Triazine ring-containing polymer and composition for pattern formation 日产化学株式会社 2023-12-22 CN claimed
CN-117279998-A Solvent-free composition 日产化学株式会社 2023-12-22 CN claimed
CN-117255822-A Triazine ring-containing polymer and composition for pattern formation 日产化学株式会社 2023-12-19 CN claimed
CN-117222691-A Triazine ring-containing polymer and film-forming composition containing same 日产化学株式会社 2023-12-12 CN claimed
WO-2023182309-A1 COMPOUND, POLYMER, COMPOSITION, RUST-PREVENTIVE AGENT, ADHESIVE AGENT, AND COATING AGENT 三井化学株式会社 2023-09-28 WO claimed
US-4985342-A Semiconductors, Integrated Circuits TORAY SILICONE COMPANY, LTD. (JP) 1991-01-15 US claimed
EP-0164598-B1 PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR FORMING PHOTO-RESIST PATTERN USING THE SAME NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1990-09-12 EP claimed
EP-0163433-B1 ANTIBACTERIAL SOLID COMPOSITION FOR ORAL ADMINISTATION Takeda Chemical Industries, Ltd. (JP) 1990-08-01 EP claimed
US-4900582-A EXPOSURE TO ULTRAVIOLET RADIATION IN ZONE ATMOSPHERE TOKYO OHKA KOGYO CO., LTD. (JP) 1990-02-13 US claimed
EP-0145347-B1 DRY FILM RESISTS IMPERIAL CHEMICAL INDUSTRIES PLC (GB) 1989-04-19 EP claimed
EP-0266436-A1 Substituted fatty ethers HENKEL CORPORATION (a Delaware corp.) (US) 1988-05-11 EP claimed
EP-0262255-A1 Acryloxymethyl substituted fatty compounds HENKEL CORPORATION (a Delaware corp.) (US) 1988-04-06 EP claimed
US-4702990-A Photosensitive resin composition and process for forming photo-resist pattern using the same NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1987-10-27 US claimed
US-4626582-A Acryloxymethyl substituted fatty compounds HENKEL CORPORATION (US) 1986-12-02 US claimed
EP-0164598-A2 Photosensitive resin composition and process for forming photo-resist pattern using the same NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1985-12-18 EP claimed