SCHEMBL22147351

SCHEMBL22147351

Oc1ccc(-c2c(-c3ccccc3)c(-c3ccccc3)c(-c3ccccc3)c(-c3ccccc3)c2-c2ccc(-c3c(-c4ccccc4)c(-c4ccccc4)c(-c4ccccc4)c(-c4ccccc4)c3-c3ccc(O)cc3)cc2)cc1

nearest known ligand 0.78

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MMP3 P08254 1/20 0.78
BCL2L1 Q07817 1/20 0.78
ESR1 P03372 9/20 0.61
ESR2 Q92731 7/20 0.61
PDE4A P27815 1/20 0.57
PDE4B Q07343 1/20 0.57
PDE4C Q08493 1/20 0.57
PDE4D Q08499 1/20 0.57
CA12 O43570 1/20 0.56
CA1 P00915 1/20 0.56
CA2 P00918 1/20 0.56
GLA P06280 1/20 0.56
CA3 P07451 1/20 0.56
CA4 P22748 1/20 0.56
CA9 Q16790 1/20 0.56
TDP1 Q9NUW8 1/20 0.56
CA14 Q9ULX7 1/20 0.56
MEN1 O00255 4/20 0.55
KMT2A Q03164 4/20 0.55
NTSR1 P30989 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20323157 1.00 MMP3 (0.78) MMP3BCL2L1ESR1ESR2PDE4A
SCHEMBL22147379 1.00 MMP3 (0.78) MMP3BCL2L1ESR1ESR2PDE4A
SCHEMBL28979295 1.00 MMP3 (0.78) MMP3BCL2L1ESR1ESR2PDE4A
SCHEMBL20323048 1.00 MMP3 (0.78) MMP3BCL2L1ESR1ESR2PDE4A
SCHEMBL21667678 0.97 MMP3 (0.74) MMP3BCL2L1ESR1ESR2PDE4A
SCHEMBL21667783 0.97 MMP3 (0.83) MMP3BCL2L1ESR1ESR2PDE4A
SCHEMBL20323043 0.97 MMP3 (0.83) MMP3BCL2L1ESR1ESR2PDE4A
SCHEMBL16420022 0.97 MMP3 (0.83) MMP3BCL2L1ESR1ESR2PDE4A
SCHEMBL29287283 0.92 MMP3 (0.67) MMP3BCL2L1ESR1ESR2PDE4A
SCHEMBL20323049 0.88 ESR1 (0.61) MMP3BCL2L1ESR1ESR2PDE4A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200201185-A1 HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS SAMSUNG SDI CO., LTD. (KR) 2020-06-25 US disclosed