⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13021525 | 0.74 | — | — | |
| SCHEMBL599511 | 0.73 | — | — | |
| SCHEMBL9878846 | 0.71 | TSHR (0.32) | — | |
| SCHEMBL477941 | 0.71 | — | — | |
| SCHEMBL5616883 | 0.69 | — | — | |
| SCHEMBL236907 | 0.69 | — | — | |
| SCHEMBL8845251 | 0.69 | — | — | |
| SCHEMBL175676 | 0.69 | — | — | |
| SCHEMBL8845256 | 0.69 | — | — | |
| SCHEMBL8944182 | 0.69 | ALDH1A1 (0.35) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11319397-B2 | Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board | SHENGYI TECHNOLOGY CO., LTD. (CN) | 2022-05-03 | — | — | US | disclosed |
| US-20200208057-A1 | INTRINSIC FLAME-RETARDANT RESIN WITH LOW POLARITY, AND PREPARATION METHOD THEREFOR AND USE THEREOF | SHENGYI TECHNOLOGY CO., LTD. (CN) | 2020-07-02 | — | — | US | disclosed |
| US-20200207899-A1 | THERMOSETTING RESIN COMPOSITION, PREPREG MADE THEREFROM, LAMINATE CLAD WITH METAL FOIL, AND HIGH-FREQUENCY CIRCUIT BOARD | SHENGYI TECHNOLOGY CO., LTD. (CN) | 2020-07-02 | — | — | US | disclosed |