SCHEMBL22300720

SCHEMBL22300720

O=C1C2(CCCC13CC1CCC3C1)CC1CCC2C1

nearest known ligand 0.37

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
LIG1 P18858 3/20 0.37
HSD11B1 P28845 2/20 0.31
ALOX5AP P20292 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22300885 0.91 ALOX5AP (0.33) HSD11B1ALOX5AP
SCHEMBL12972100 0.80
SCHEMBL11412903 0.80
SCHEMBL26117646 0.79 KDM1A (0.31)
SCHEMBL20507029 0.76 ADORA3 (0.33) HSD11B1ALOX5AP
SCHEMBL106215 0.71
SCHEMBL18499598 0.71
SCHEMBL19036971 0.70
SCHEMBL11755473 0.69 CYP19A1 (0.35)
SCHEMBL29533016 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220162445-A1 POLYIMIDE COMPOUND AND MOLDED ARTICLE COMPRISING THE POLYIMIDE COMPOUND WINGO TECHNOLOGY CO., LTD. (JP) 2022-05-26 US disclosed
EP-3919548-A1 POLYIMIDE COMPOUND AND MOLDED ARTICLE CONTAINING SAID POLYIMIDE COMPOUND Wingo Technology Co., Ltd. (JP) 2021-12-08 EP disclosed
WO-2020157953-A1 POLYIMIDE COMPOUND AND MOLDED ARTICLE CONTAINING SAID POLYIMIDE COMPOUND ウィンゴーテクノロジー株式会社 2020-08-06 WO disclosed