SCHEMBL22304500

SCHEMBL22304500

CCC(C)(CC)Oc1ccc(C(=O)c2ccc(C(=O)c3ccc(C(C)(CC)CC)cc3)cc2)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ELANE P08246 9/20 0.45
PPARG P37231 5/20 0.44
PPARA Q07869 2/20 0.44
FABP2 P12104 1/20 0.44
SLC22A12 Q96S37 1/20 0.44
KMT2A Q03164 2/20 0.43
NPSR1 Q6W5P4 2/20 0.43
LMNA P02545 2/20 0.43
MAPK1 P28482 2/20 0.43
TDP1 Q9NUW8 2/20 0.43
MEN1 O00255 1/20 0.43
USP2 O75604 1/20 0.43
ABCB11 O95342 1/20 0.43
CYP1A2 P05177 1/20 0.43
CYP3A4 P08684 1/20 0.43
ADORA3 P0DMS8 1/20 0.43
MAPT P10636 1/20 0.43
CYP2C9 P11712 1/20 0.43
ADRB3 P13945 1/20 0.43
HPGD P15428 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12943146 0.96 RAB9A (0.42) ELANEPPARGPPARAFABP2SLC22A12
SCHEMBL20144384 0.96 RAB9A (0.42) ELANEPPARGPPARAFABP2SLC22A12
SCHEMBL22304593 0.96 RAB9A (0.42) ELANEPPARGPPARAFABP2SLC22A12
SCHEMBL20144400 0.92 ACACB (0.41) ELANEPPARGPPARAFABP2SLC22A12
SCHEMBL20144377 0.92 ACACB (0.41) ELANEPPARGPPARAFABP2SLC22A12
SCHEMBL20144414 0.92 ACACB (0.41) ELANEPPARGPPARAFABP2SLC22A12
SCHEMBL13374819 0.92 RAB9A (0.40) ELANEPPARGPPARAFABP2SLC22A12
SCHEMBL14283250 0.90 ELANE (0.52) ELANEPPARGPPARAFABP2SLC22A12
SCHEMBL13537025 0.88 ELANE (0.45) ELANEPPARGPPARAFABP2SLC22A12
SCHEMBL19339482 0.85 ELANE (0.49) ELANEKMT2ANPSR1MAPTCYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020158453-A1 SURFACE MODIFICATION METHOD, BONDING METHOD, SURFACE MODIFICATION MATERIAL, AND ASSEMBLY 三菱重工業株式会社 2020-08-06 WO disclosed