Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA2 | P00918 | 20/20 | 0.50 |
| ▸ | CA1 | P00915 | 19/20 | 0.50 |
| ▸ | MMP1 | P03956 | 5/20 | 0.50 |
| ▸ | MMP2 | P08253 | 5/20 | 0.50 |
| ▸ | MMP9 | P14780 | 5/20 | 0.50 |
| ▸ | MMP8 | P22894 | 5/20 | 0.50 |
| ▸ | MMP13 | P45452 | 5/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2230420 | 0.97 | CA2 (0.48) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL2230869 | 0.97 | CA2 (0.48) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL2232021 | 0.97 | CA2 (0.48) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL548088 | 0.95 | CA2 (0.54) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL3433952 | 0.92 | CA2 (0.48) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL3434755 | 0.92 | CA2 (0.60) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL2231262 | 0.90 | CA2 (0.46) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL2233445 | 0.90 | CA2 (0.46) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL2232023 | 0.90 | CA2 (0.46) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL2513548 | 0.90 | CA2 (0.58) | CA2CA1MMP1MMP2MMP9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2578567-B1 | PROCESS FOR PREPARATION OF FLUORINE-CONTAINING IMIDE COMPOUNDS | MITSUBISHI MATERIALS CORP (JP) | 2016-01-13 | — | — | EP | disclosed |
| US-8936674-B2 | Conductive silica sol composition, and molded article produced using the same | MITSUBISHI MATERIALS CORPORATION (JP) | 2015-01-20 | — | — | US | disclosed |
| US-8759578-B2 | Method for manufacturing fluorine-containing imide compound | MITSUBISHI MATERIALS CORPORATION (JP) | 2014-06-24 | — | — | US | disclosed |
| US-20130137899-A1 | PROCESS FOR PRODUCING FLUORINE-CONTAINING SULFONYLIMIDE COMPOUND | MITSUBISHI MATERIALS ELECTRONIC CHEMICALS CO., LTD (JP) | 2013-05-30 | — | — | US | disclosed |
| US-20130102506-A1 | LUBRICANT BASE OIL AND LUBRICANT COMPOSITION | IDEMITSU KOSAN CO., LTD. (JP) | 2013-04-25 | — | — | US | disclosed |
| EP-2578567-A1 | PROCESS FOR PREPARATION OF FLUORINE-CONTAINING IMIDE COMPOUNDS | Mitsubishi Materials Corporation (JP) | 2013-04-10 | — | — | EP | disclosed |
| US-20130066110-A1 | METHOD FOR MANUFACTURING FLUORINE-CONTAINING IMIDE COMPOUND | MITSUBISHI MATERIALS CORPORATION (JP) | 2013-03-14 | — | — | US | disclosed |
| US-20120094235-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2012-04-19 | — | — | US | disclosed |
| US-20110210295-A1 | Conductive silica sol composition, and molded article produced using the same | MITSUBISHI MATERIALS CORPORATION (JP) | 2011-09-01 | — | — | US | disclosed |
| EP-2354206-A1 | ELECTRICALLY CONDUCTIVE SILICA SOL COMPOSITION AND MOLDED ARTICLE PRODUCED BY USING SAME | Mitsubishi Materials Corporation (JP) | 2011-08-10 | — | — | EP | disclosed |
| US-20080081292-A1 | RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2008-04-03 | — | — | US | disclosed |