SCHEMBL2231402

SCHEMBL2231402

O=S(=O)(F)NS(=O)(=O)C(F)(F)C(F)(F)F.[NaH]

nearest known ligand 0.42

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
CA1 P00915 5/20 0.42
CA2 P00918 5/20 0.42
MMP1 P03956 3/20 0.39
MMP2 P08253 3/20 0.39
MMP9 P14780 3/20 0.39
MMP8 P22894 3/20 0.39
MMP13 P45452 3/20 0.39
CA7 P43166 1/20 0.30
CA13 Q8N1Q1 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2231717 0.97 CA1 (0.43) CA1CA2MMP1MMP2MMP9
Ammonia Solution, Strong SCHEMBL17435839 0.95 CA1 (0.42) CA1CA2MMP1MMP2MMP9
SCHEMBL17435915 0.95 CA1 (0.42) CA1CA2MMP1MMP2MMP9
SCHEMBL2234125 0.95 CA1 (0.42) CA1CA2MMP1MMP2MMP9
SCHEMBL2233597 0.95 CA1 (0.42) CA1CA2MMP1MMP2MMP9
Dimethylamine SCHEMBL17435927 0.90 CA1 (0.39) CA1CA2MMP1MMP2MMP9
Tetramethylammonium Ion SCHEMBL17435846 0.88 CA1 (0.37) CA1CA2MMP1MMP2MMP9
Trimethylammonium SCHEMBL17435891 0.88 CA1 (0.37) CA1CA2MMP1MMP2MMP9
SCHEMBL2230987 0.83 CA2 (0.52) CA1CA2MMP1MMP2MMP9
SCHEMBL2296771 0.83 CA2 (0.61) CA1CA2MMP1MMP2MMP9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9950929-B2 Method for producing disulfonylamine alkali metal salt NIPPON SODA CO., LTD. (JP) 2018-04-24 US disclosed
EP-2977349-A1 METHOD FOR PRODUCING DISULFONYLAMINE ALKALI METAL SALT Nippon Soda Co., Ltd. (JP) 2016-01-27 EP disclosed
US-20160016797-A1 METHOD FOR PRODUCING DISULFONYLAMINE ALKALI METAL SALT NIPPON SODA CO., LTD. (JP) 2016-01-21 US disclosed
US-8936674-B2 Conductive silica sol composition, and molded article produced using the same MITSUBISHI MATERIALS CORPORATION (JP) 2015-01-20 US disclosed
US-20110210295-A1 Conductive silica sol composition, and molded article produced using the same MITSUBISHI MATERIALS CORPORATION (JP) 2011-09-01 US disclosed
EP-2354206-A1 ELECTRICALLY CONDUCTIVE SILICA SOL COMPOSITION AND MOLDED ARTICLE PRODUCED BY USING SAME Mitsubishi Materials Corporation (JP) 2011-08-10 EP disclosed