SCHEMBL2234066

SCHEMBL2234066

CCCCO[Si](CC)(OCCCC)OCC(CC)C1CCC2OC2C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2008937 0.87
SCHEMBL21352275 0.85
SCHEMBL6251639 0.79
SCHEMBL2234647 0.77
SCHEMBL188093 0.77
SCHEMBL21352273 0.77 PPM1B (0.31)
SCHEMBL21352274 0.76
SCHEMBL19229270 0.76
SCHEMBL28546178 0.74 ALDH1A1 (0.31)
SCHEMBL28542771 0.74 ALDH1A1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1199313-B1 Diene polymers and copolymers having an alkoxysilane group BRIDGESTONE CORP (JP) 2005-08-24 EP claimed
CN-117859097-A Method for manufacturing substrate with cured film, and element provided with substrate with cured film 东丽株式会社 2024-04-09 CN disclosed
CN-117859098-A Photosensitive resin composition and microlens 东丽株式会社 2024-04-09 CN disclosed
CN-117362906-A ABS resin composition, molded article, and coated molded article 旭化成株式会社 2024-01-09 CN disclosed
CN-110573964-B Negative photosensitive resin composition and cured film 东丽株式会社 2023-11-03 CN disclosed
US-20230348750-A1 LOW INTERFERENCE FRINGE OPTICAL ARTICLE AND COATING AGENT COMPOSITION THEREOF NIPPON FINE CHEMICAL CO., LTD. (JP) 2023-11-02 US disclosed
CN-110419000-B Photosensitive silicone resin composition, cured film, and member for touch panel 东丽株式会社 2023-07-28 CN disclosed
EP-4186949-A1 OPTICAL PRODUCT WITH REDUCED INTERFERENCE FRINGES, AND COATING AGENT COMPOSITION THEREFOR Nippon Fine Chemical Co., Ltd. (JP) 2023-05-31 EP disclosed
CN-113348207-B Block copolymer composition, molded article, method for producing molded article, and method for adjusting haze value of molded article 旭化成株式会社 2023-05-12 CN disclosed
CN-114303099-A Photosensitive resin composition, cured film and display device 东丽株式会社 2022-04-08 CN disclosed
CN-110546207-A Transparent resin composition, transparent coating film and transparent resin-coated glass substrate TORAY INDUSTRIES 2019-12-06 CN disclosed
EP-2468682-B1 Method for producing zirconia sol NISSAN CHEMICAL IND LTD (JP) 2014-01-15 EP disclosed
EP-1798201-B1 METHOD FOR PRODUCING METAL OXIDE SOL NISSAN CHEMICAL IND LTD (JP) 2013-04-03 EP disclosed
EP-2468682-A1 Method for producing zirconia sol Nissan Chemical Industries, Ltd. (JP) 2012-06-27 EP disclosed
EP-2360194-A1 SILOXANE RESIN COMPOSITION AND PROTECTIVE FILM FOR TOUCH PANEL USING SAME Toray Industries, Inc. (JP) 2011-08-24 EP disclosed
EP-1924608-A2 FUNCTIONALIZED POLYMERS AND IMPROVED TIRES THEREFROM Bridgestone Corporation (JP) 2008-05-28 EP disclosed
EP-1798201-A1 METHOD FOR PRODUCING METAL OXIDE SOL Nissan Chemical Industries, Ltd. (JP) 2007-06-20 EP disclosed
WO-2007024797-A2 FUNCTIONALIZED POLYMERS AND IMPROVED TIRES THEREFROM BRIDGESTONE CORPORATION (JP) 2007-03-01 WO disclosed
EP-1022323-A1 SURFACE TREATMENT COMPOSITION, METHOD OF SURFACE TREATMENT, SUBSTRATE, AND ARTICLE ASAHI GLASS COMPANY LTD. (JP) 2000-07-26 EP disclosed
US-5645901-A RESIN SUBSTRATE, CURED COATING LAMINATED TO SUBSTRATE, SILOXANE CURED COATING CONTAINING FINE SILICA PARTICLES, AND INDIUM TIN OXIDE FILM SHARP KABUSHIKI KAISHA (JP) 1997-07-08 US disclosed