⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14266203 | 0.79 | TSHR (0.38) | — | |
| SCHEMBL13458870 | 0.79 | TSHR (0.38) | — | |
| SCHEMBL23096948 | 0.76 | — | — | |
| SCHEMBL8081454 | 0.76 | — | — | |
| Hydrochloric Acid SCHEMBL16931645 | 0.74 | ALDH1A1 (0.33) | — | |
| SCHEMBL5706631 | 0.73 | — | — | |
| SCHEMBL14389486 | 0.73 | TSHR (0.33) | — | |
| Hydrochloric Acid SCHEMBL6261036 | 0.73 | — | — | |
| Hydrochloric Acid SCHEMBL4649337 | 0.73 | — | — | |
| SCHEMBL1104134 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111732897-A | Chemical mechanical polishing for copper and through silicon via applications | 弗萨姆材料美国有限责任公司 | 2020-10-02 | — | — | CN | claimed |
| US-20200277514-A1 | Chemical Mechanical Polishing For Copper And Through Silicon Via Applications | VERSUM MATERIALS US, LLC (US) | 2020-09-03 | — | — | US | claimed |
| EP-3702425-A1 | CHEMICAL MECHANICAL POLISHING FOR COPPER AND THROUGH SILICON VIA APPLICATIONS | Versum Materials US, LLC (US) | 2020-09-02 | — | — | EP | claimed |
| CN-118024153-B | PH value self-adaptive chemical mechanical polishing pad, preparation method and application thereof | 万华化学集团电子材料有限公司 | 2026-05-19 | — | — | CN | disclosed |
| CN-119748318-A | Polishing method using chemical mechanical polishing pad | 杜邦电子材料控股股份有限公司 | 2025-04-04 | — | — | CN | disclosed |
| CN-119748316-A | Chemical mechanical polishing pad | 杜邦电子材料控股股份有限公司 | 2025-04-04 | — | — | CN | disclosed |
| CN-118024153-A | PH value self-adaptive chemical mechanical polishing pad, preparation method and application thereof | 万华化学集团电子材料有限公司 | 2024-05-14 | — | — | CN | disclosed |
| US-20230365563-A1 | QUINAZOLINE COMPOUND AND APPLICATION THEREOF | SHANGHAI PHARMACEUTICALS HOLDING CO., LTD. (CN) | 2023-11-16 | — | — | US | disclosed |
| US-20200277514-A1 | Chemical Mechanical Polishing For Copper And Through Silicon Via Applications | VERSUM MATERIALS US, LLC (US) | 2020-09-03 | — | — | US | disclosed |
| EP-3702425-A1 | CHEMICAL MECHANICAL POLISHING FOR COPPER AND THROUGH SILICON VIA APPLICATIONS | Versum Materials US, LLC (US) | 2020-09-02 | — | — | EP | disclosed |