SCHEMBL224154

SCHEMBL224154

Cc1cc(C)c(O)c(/C=C/c2cc(C)cc(C)c2O)c1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 10/20 0.52
PTGS2 P35354 10/20 0.52
ALOX5 P09917 8/20 0.52
ALDH1A1 P00352 3/20 0.50
ERN1 O75460 2/20 0.50
GAA P10253 2/20 0.50
MAPT P10636 2/20 0.50
KDM4E B2RXH2 1/20 0.50
LMNA P02545 1/20 0.50
SELL P14151 1/20 0.42
SELP P16109 1/20 0.42
SELE P16581 1/20 0.42
CA1 P00915 1/20 0.42
CA2 P00918 1/20 0.42
CYP1A2 P05177 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2D6 P10635 1/20 0.39
CYP2C9 P11712 1/20 0.39
CYP2B6 P20813 1/20 0.39
TTR P02766 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL224155 1.00 PTGS1 (0.52) PTGS1PTGS2ALOX5ALDH1A1ERN1
SCHEMBL27994271 0.84 PTGS1 (0.65) PTGS1PTGS2ALOX5TTR
SCHEMBL27958959 0.82 IAPP (0.47) PTGS1PTGS2ALOX5ALDH1A1ERN1
SCHEMBL6225207 0.82 SMN1; SMN2 (0.46) PTGS1PTGS2ALOX5ALDH1A1ERN1
SCHEMBL6225203 0.82 SMN1; SMN2 (0.46) PTGS1PTGS2ALOX5ALDH1A1ERN1
SCHEMBL29957335 0.81 ERN1 (0.78) PTGS1PTGS2ALOX5ALDH1A1ERN1
SCHEMBL2788053 0.81 ERN1 (0.78) PTGS1PTGS2ALOX5ALDH1A1ERN1
SCHEMBL8259227 0.81 ALDH1A1 (0.46) PTGS1PTGS2ALOX5ALDH1A1ERN1
SCHEMBL11408969 0.79 ERN1 (0.75) PTGS1PTGS2ALOX5ALDH1A1ERN1
SCHEMBL10385623 0.79 PTGS1 (0.65) PTGS1PTGS2ALOX5ALDH1A1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 204 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20110163461-A1 ELECTRONIC PACKAGING EVONIK DEGUSSA GMBH (DE) 2011-07-07 US claimed
JP-10204331-A None JP disclosed
US-10428216-B2 Golf ball incorporating a mixture of a thermoset and/or thermoplastic composition and a plurality of conductive nanoshelled structures ACUSHNET COMPANY (US) 2019-10-01 US disclosed
US-20190192922-A1 GOLF BALL COMPRISING MEDIUM HARDNESS GRADIENT CORE ACUSHNET COMPANY (US) 2019-06-27 US disclosed
US-10252115-B2 Golf ball incorporating positive hardness gradient thermoset polyurethane outer cover layer ACUSHNET COMPANY (US) 2019-04-09 US disclosed
US-10220263-B2 Golf balls comprising medium hardness gradient core ACUSHNET COMPANY (US) 2019-03-05 US disclosed
US-10130848-B2 Golf ball multilayer core having a gradient quotient ACUSHNET COMPANY (US) 2018-11-20 US disclosed
US-20180318654-A1 GOLF BALL INCORPORATING POSITIVE HARDNESS GRADIENT THERMOSET POLYURETHANE OUTER COVER LAYER ACUSHNET COMPANY (US) 2018-11-08 US disclosed
US-10112081-B2 Golf ball incorporating positive hardness gradient thermoset polyurethane outer cover layer ACUSHNET COMPANY (US) 2018-10-30 US disclosed
US-10035046-B2 Multilayer core golf ball having hardness gradient within and between each core layer ACUSHNET COMPANY (US) 2018-07-31 US disclosed
US-5939509-A Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LTD. (JP) 1999-08-17 US disclosed
EP-0739877-B1 Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL CO (JP) 1999-08-04 EP disclosed
US-5854370-A Epoxy resin stilbenes and process for producing the same by photoisomerization SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-12-29 US disclosed
EP-0869148-A1 Epoxy resin composition and method for producing the same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-10-07 EP disclosed
EP-0869140-A2 Epoxy resin composition and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-10-07 EP disclosed
JP-H10204331-A POWDER COATING MATERIAL AND ARTICLE COATED THEREWITH SUMITOMO CHEM CO LTD 1998-08-04 JP disclosed
US-5705596-A STILBENE COMPOUNDS FOR ADHESIVES, PAINTS, ELECTRONICS AND INSULATION OF LAMINATES SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-01-06 US disclosed
EP-0580872-B1 POLYOXYMETHYLENE COMPOSITION AND MOLDED ARTICLE POLYPLASTICS CO (JP) 1997-03-19 EP disclosed
EP-0739877-A2 Epoxy resin, resin composition, and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY LIMITED (JP) 1996-10-30 EP disclosed
EP-0580872-A1 POLYOXYMETHYLENE COMPOSITION AND MOLDED ARTICLE POLYPLASTICS CO. LTD. (JP) 1994-02-02 EP disclosed