SCHEMBL22471778

SCHEMBL22471778

C=CC(=O)ON1C(C)(C)CCC(C)C1(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22471779 0.78 ALDH1A1 (0.31)
SCHEMBL1047285 0.76 TSHR (0.35)
SCHEMBL21808442 0.73 TSHR (0.33)
SCHEMBL27487453 0.68 GAA (0.33)
SCHEMBL27945465 0.68 CYP2C19 (0.32)
SCHEMBL25701767 0.68 TSHR (0.43)
SCHEMBL21693914 0.66
SCHEMBL2202765 0.66 TSHR (0.30)
SCHEMBL1254958 0.66
SCHEMBL25701770 0.65 SMN1; SMN2 (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020196139-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT 東レ株式会社 2020-10-01 WO disclosed
CN-110419001-A Photosensitive polymer combination, photosensitive polymer combination film, insulating film and electronic component TORAY INDUSTRIES 2019-11-05 CN disclosed
CN-110016170-A A kind of low water vapor transmittance polyolefin elastomer glue film and preparation method 杭州福斯特应用材料股份有限公司 2019-07-16 CN disclosed
CN-109906217-A Diamine compound, heat-resistant resin and resin combination using it 东丽株式会社 2019-06-18 CN disclosed
CN-105960441-B It is used to form the coating composition of the film with impact resistance 关西涂料株式会社 2019-04-16 CN disclosed
CN-109313387-A Photosensitive polymer combination 东丽株式会社 2019-02-05 CN disclosed
CN-108137805-A Resin and photosensitive polymer combination 东丽株式会社 2018-06-08 CN disclosed
CN-101142529-B Photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2012-02-22 CN disclosed