Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.45 |
| ▸ | ANPEP | P15144 | 2/20 | 0.44 |
| ▸ | ERAP2 | Q6P179 | 2/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.42 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.42 |
| ▸ | RAD52 | P43351 | 1/20 | 0.40 |
| ▸ | CXCR4 | P61073 | 6/20 | 0.39 |
| ▸ | CXCL12 | P48061 | 1/20 | 0.39 |
| ▸ | SOS1 | Q07889 | 1/20 | 0.37 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.36 |
| ▸ | HRH3 | Q9Y5N1 | 2/20 | 0.36 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.36 |
| ▸ | DPP7 | Q9UHL4 | 1/20 | 0.35 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28831940 | 0.98 | KDM4E (0.41) | KDM4EANPEPERAP2ALDH1A1HSD17B10 | |
| SCHEMBL10895092 | 0.83 | KDM4E (0.42) | KDM4EANPEPERAP2ALDH1A1RAD52 | |
| SCHEMBL3679901 | 0.77 | ALDH1A1 (0.52) | KDM4EANPEPERAP2ALDH1A1RAD52 | |
| SCHEMBL7777018 | 0.77 | ALDH1A1 (0.52) | KDM4EANPEPERAP2ALDH1A1RAD52 | |
| SCHEMBL1779849 | 0.77 | RAD52 (0.56) | KDM4EALDH1A1HSD17B10RAD52CXCR4 | |
| SCHEMBL455085 | 0.77 | RAD52 (0.56) | KDM4EALDH1A1HSD17B10RAD52CXCR4 | |
| SCHEMBL28990566 | 0.77 | ANPEP (0.38) | KDM4EANPEPERAP2RAD52CXCR4 | |
| SCHEMBL21192378 | 0.77 | ANPEP (0.38) | KDM4EANPEPERAP2RAD52CXCR4 | |
| SCHEMBL80882 | 0.76 | KDM4E (0.37) | KDM4EANPEPERAP2ALDH1A1RAD52 | |
| SCHEMBL27728131 | 0.76 | KDM4E (0.37) | KDM4EANPEPERAP2ALDH1A1RAD52 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117843944-A | Polyether polyol for low-density high-resilience foam | 万华化学集团股份有限公司 | 2024-04-09 | — | — | CN | claimed |
| CN-114907216-B | Hydrogenation method of dicyanoethyl tertiary amine | 万华化学集团股份有限公司 | 2024-02-02 | — | — | CN | claimed |
| CN-115028537-B | Preparation method of aminopropyl alicyclic secondary amine | 万华化学集团股份有限公司 | 2023-08-11 | — | — | CN | claimed |
| CN-116262874-A | Thermosetting composition, thermosetting insulating adhesive composition and application | 杭州之江有机硅化工有限公司 | 2023-06-16 | — | — | CN | claimed |
| CN-114853633-B | Preparation method of bis-aminopropyl alicyclic tertiary amine | 万华化学集团股份有限公司 | 2023-05-30 | — | — | CN | claimed |
| CN-115677509-A | Preparation method of N, N-bisaminopropylcyclohexylamine | 万华化学集团股份有限公司 | 2023-02-03 | — | — | CN | claimed |
| CN-115028537-A | Preparation method of aminopropyl alicyclic secondary amine | 万华化学集团股份有限公司 | 2022-09-09 | — | — | CN | claimed |
| CN-114907216-A | Hydrogenation method of dicyanoethyl tertiary amine | 万华化学集团股份有限公司 | 2022-08-16 | — | — | CN | claimed |
| CN-114853633-A | Preparation method of bisaminopropyl alicyclic tertiary amine | 万华化学集团股份有限公司 | 2022-08-05 | — | — | CN | claimed |
| CN-119058235-A | Fluid ejection head, method for manufacturing fluid ejection head, fluid ejection assembly, and fluid ejection device | 株式会社理光 | 2024-12-03 | — | — | CN | disclosed |
| CN-118679204-A | Curing agent and adhesive for epoxy resin | 盛势达技研株式会社 | 2024-09-20 | — | — | CN | disclosed |
| CN-118369320-A | Compound, curable resin composition, and cured product | 株式会社艾迪科 | 2024-07-19 | — | — | CN | disclosed |
| CN-113544183-B | Curable resin composition | 株式会社艾迪科 | 2024-07-02 | — | — | CN | disclosed |
| CN-114651025-B | Curable composition, cured product, fiber-reinforced composite material, molded article, and method for producing same | DIC株式会社 | 2024-06-04 | — | — | CN | disclosed |
| CN-113544183-A | Curable resin composition | 株式会社艾迪科 | 2021-10-22 | — | — | CN | disclosed |
| WO-2021112104-A1 | RESIN COMPOSITION | 株式会社ADEKA | 2021-06-10 | — | — | WO | disclosed |
| WO-2021095534-A1 | CURABLE COMPOSITION, CURED OBJECT, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE AND PRODUCTION METHOD THEREFOR | DIC株式会社 | 2021-05-20 | — | — | WO | disclosed |
| WO-2021049390-A1 | CURABLE RESIN COMPOSITION | 株式会社ADEKA | 2021-03-18 | — | — | WO | disclosed |
| WO-2020196819-A1 | CURABLE RESIN COMPOSITION | 株式会社ADEKA | 2020-10-01 | — | — | WO | disclosed |
| CN-107001593-B | Thermosetting resin composition | 三键有限公司 | 2020-01-17 | — | — | CN | disclosed |