SCHEMBL22472283

SCHEMBL22472283

C=Cc1cccc(C)c1OCCCCC

nearest known ligand 0.41

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 2/20 0.41
▸ KDM4E B2RXH2 2/20 0.41
▸ MEN1 O00255 2/20 0.39
▸ KMT2A Q03164 2/20 0.39
▸ LMNA P02545 1/20 0.39
▸ MAPT P10636 1/20 0.39
▸ NPSR1 Q6W5P4 1/20 0.39
▸ HSD17B10 Q99714 1/20 0.39
▸ TLR4 O00206 3/20 0.38
▸ SCN8A Q9UQD0 6/20 0.38
▸ TSHR P16473 1/20 0.37
▸ LTA4H P09960 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27596133 0.98 ALDH1A1 (0.43) ALDH1A1KDM4EMEN1KMT2ALMNA
SCHEMBL16956478 0.83 SCN4A (0.38) ALDH1A1KDM4ELMNAMAPTHSD17B10
SCHEMBL23817559 0.82 ALDH1A1 (0.54) ALDH1A1KDM4EMEN1KMT2ALMNA
SCHEMBL28730789 0.81 ALDH1A1 (0.57) ALDH1A1KDM4EMEN1KMT2ALMNA
SCHEMBL2713101 0.81 ALDH1A1 (0.57) ALDH1A1KDM4EMEN1KMT2ALMNA
SCHEMBL12914740 0.81 ALDH1A1 (0.57) ALDH1A1KDM4EMEN1KMT2ALMNA
SCHEMBL28730794 0.81 ALDH1A1 (0.57) ALDH1A1KDM4EMEN1KMT2ALMNA
SCHEMBL28285749 0.79 SCN4A (0.40) ALDH1A1KDM4ELMNAMAPTSCN8A
SCHEMBL4382775 0.77 ALDH1A1 (0.55) ALDH1A1KDM4EMEN1KMT2ALMNA
SCHEMBL28098717 0.76 MCHR1 (0.43) ALDH1A1MEN1KMT2ALMNAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021079819-A1 COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN パナソニックIPマネジメント株式会社 2021-04-29 — — WO disclosed
WO-2021079817-A1 METAL CLAD LAMINATE, WIRING BOARD, RESIN-INCLUDING METAL FOIL, AND RESIN COMPOSITION パナソニックIPマネジメント株式会社 2021-04-29 — — WO disclosed
WO-2021060178-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2021-04-01 — — WO disclosed
WO-2021024923-A1 RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD パナソニックIPマネジメント株式会社 2021-02-11 — — WO disclosed
WO-2020230870-A1 COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL パナソニックIPマネジメント株式会社 2020-11-19 — — WO disclosed
WO-2020196759-A1 PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2020-10-01 — — WO disclosed
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