SCHEMBL2264425

SCHEMBL2264425

CCCC(NC)[Si](OC)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2268060 0.83
SCHEMBL108964 0.80
SCHEMBL200379 0.79
SCHEMBL21049764 0.79 HTR2A (0.30)
SCHEMBL6129722 0.74
SCHEMBL14059867 0.73
SCHEMBL5174767 0.73 CHRM1 (0.35)
SCHEMBL29050278 0.70
SCHEMBL2117717 0.69 TDP1 (0.39)
SCHEMBL314474 0.69 FDPS (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108463493-B Polymeric substrate having a surface with reduced biomolecule adhesion and thermoplastic articles of such substrate SIO2医药产品公司 2021-10-15 CN disclosed
EP-2137198-B1 EPOXYSILANES, PROCESSES FOR THEIR MANUFACTURE AND CURABLE COMPOSITIONS CONTAINING SAME MOMENTIVE PERFORMANCE MAT INC (US) 2016-05-18 EP disclosed
US-7989651-B2 trimethoxysilylpropyl-carbamic acid oxiranylmethyl ester; reacting glycidol with gamma-isocyanatopropyltriethoxysilane in presence of dibutyltin laurate catalyst MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2011-08-02 US disclosed
EP-2137198-A1 EPOXYSILANES, PROCESSES FOR THEIR MANUFACTURE AND CURABLE COMPOSITIONS CONTAINING SAME Momentive Performance Materials Inc. (US) 2009-12-30 EP disclosed
WO-2008112150-A1 EPOXYSILANES, PROCESSES FOR THEIR MANUFACTURE AND CURABLE COMPOSITIONS CONTAINING SAME MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-09-18 WO disclosed
US-20080221238-A1 Epoxysilanes, processes for their manufacture and curable compositions containing same MOMENTIVE PERFORMANCE MATERIALS INC. 2008-09-11 US disclosed